Patents by Inventor Kai Ye

Kai Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110078663
    Abstract: An apparatus for cross-browser testing of a web application is disclosed, including: a first broker residing among a plurality of browsers for receiving information of a user action from a browser operated by a user among the plurality of browsers and for transmitting the information of the user action to other browsers so that the other browsers can execute the user action; a second broker residing between the plurality of browsers and the web application for receiving at least one web request generated by executing the user action from the plurality of browsers and for determining whether to be able to merge the at least one web request, so as to determine whether the plurality of browsers are compatible with the web application. An associated method is also provided.
    Type: Application
    Filed: September 27, 2010
    Publication date: March 31, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dong Huang, Yang Li, Shao Feng Shi, Kai Ye, Deng Peng Zhou
  • Patent number: 6870387
    Abstract: Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components (C=2Cc+2Cf+Ca). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cdummy of the metal line with respect to ground including fringe and area components (Cdummy=2Cf+Ca). After the two steps, the coupling capacitance Cc between the metal line and another line can be determined according to the formula Cc=(C?Cdummy)/2.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: March 22, 2005
    Assignee: Winbond Electronics Corporation
    Inventors: Kai-Ye Huang, Chuan-Jane Chao
  • Publication number: 20050024077
    Abstract: Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components(C=2Cc+2Cf+Ca). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cdummy of the metal line with respect to ground including fringe and area components (Cdummy=2Cf+Ca). After the two steps, the coupling capacitance Cc between the metal line and another line can be determined according to the formula Cc=(C-Cdummy)/2.
    Type: Application
    Filed: November 4, 2003
    Publication date: February 3, 2005
    Inventors: Kai-Ye Huang, Chuan-Jane Chao