Patents by Inventor Kai-Yi Song

Kai-Yi Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Materials and Methods for Hole Transport Layers in Perovskite Photovoltaic Devices
    Publication number: 20240138163
    Abstract: Methods and compositions for forming perovskite hole transport layers for use in manufacturing photovoltaic devices are described. Embodiments include using a plurality of hole transport materials to produce high-performance HTL contacts to improve performance and stability.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicants: First Solar, Inc., Alliance for Sustainable Energy, LLC
    Inventors: Joseph Jonathan Berry, Le Chen, Axel Finn Palmstrom, Tze-Bin Song, Vera Steinmann, Natasha Teran, Aravamuthan Varadarajan, Mengjin Yang, Xueping Yi, Zhibo Zhao, Kai Zhu
  • Multilayer Back Contacts for Perovskite Photovoltaic Devices
    Publication number: 20240138164
    Abstract: Photovoltaic devices having contact layers are described herein. Devices, intermediate structures, and methods for making multilayer contacts for perovskite photovoltaic devices are provided. Embodiments include back contacts for N-I-P structures.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicants: First Solar, Inc., Alliance for Sustainable Energy, LLC
    Inventors: Joseph Jonathan Berry, Le Chen, Axel Finn Palmstrom, Tze-Bin Song, Vera Steinmann, Natasha Teran, Aravamuthan Varadarajan, Xueping Yi, Zhibo Zhao, Kai Zhu
  • Method for forming lead-carbon compound interface layer on lead-based substrate
    Patent number: 11349110
    Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: May 31, 2022
    Assignee: NATIONAL FORMOSA UNIVERSITY
    Inventors: Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Jing-Xiu Lin, Bo-Shun Wang, Jyun-Neng Chen
  • METHOD FOR FORMING LEAD-CARBON COMPOUND INTERFACE LAYER ON LEAD-BASED SUBSTRATE
    Publication number: 20200227720
    Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.
    Type: Application
    Filed: January 13, 2020
    Publication date: July 16, 2020
    Applicant: National Formosa University
    Inventors: Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Jing-Xiu Lin, Bo-Shun Wang, Jyun-Neng Chen