Patents by Inventor Kai-Yi Tang

Kai-Yi Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093385
    Abstract: A probe card for a circuit probe test system and methods of fabrication thereof. The probe card includes a substrate portion, a guide plate having a plurality of openings, and a plurality of probe pins extending through the openings, including at least one first probe pin configured to carry power between the substrate portion and a device-under-test (DUT), at least one second probe pin configured to electrically couple the DUT to ground, and at least two third probe pins configured to carry loopback test signals between contact regions on the DUT. A low dielectric constant (low-k) material may be located between the third probe pins and the guide plate. The low-k material may prevent direct contact between the third probe pins and the relatively higher dielectric-constant material of the guide plate, which may improve the signal integrity (SI) of the loopback test signals.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 20, 2025
    Inventors: Kuan Chun CHEN, Shu An SHANG, Kai-Yi TANG, Guang-Sing HUANG
  • Publication number: 20250079327
    Abstract: Semiconductor package and method of manufacturing are presented herein. In an embodiment, a device is provided that includes a first semiconductor component embedded in a first core substrate, a first redistribution layer on a first side of the first core substrate, a second redistribution layer on a second side of the first core substrate opposite the first side, a first resin film over the second redistribution layer, a second semiconductor component embedded in a second core substrate, a third redistribution layer on a third side of the second core substrate, wherein the third redistribution layer is bonded to the second redistribution layer by the first resin film, a fourth redistribution layer on a fourth side of the second core substrate opposite the third side, and a through hole via extending through the first redistribution layer, the first core substrate, the second redistribution layer, the third redistribution layer, the second core substrate, and the fourth redistribution layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Inventors: Yu-Huan Chen, Kai-Yi Tang, Kuo-Ching Hsu
  • Publication number: 20240377446
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module for holding the antenna and disposed under the housing, and a receiving module disposed on the housing. The receiving module includes a substrate, a coupling radiation element disposed on the substrate, and a support disposed on the substrate. The coupling radiation element includes a coupling portion and a first branch connecting to the coupling portion.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Chi-Chang LAI, Kai-Yi TANG, Mill-Jer WANG
  • Patent number: 12105131
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module for holding the antenna and disposed under the housing, and a receiving module disposed on the housing. The antenna module includes a base and a flexible film disposed on the base. The receiving module includes a substrate, a coupling radiation element disposed on the substrate and a support disposed on the substrate and having an opening. The antenna is partially exposed from the opening.
    Type: Grant
    Filed: June 22, 2023
    Date of Patent: October 1, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Chang Lai, Kai-Yi Tang, Mill-Jer Wang
  • Publication number: 20230333150
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module for holding the antenna and disposed under the housing, and a receiving module disposed on the housing. The antenna module includes a base and a flexible film disposed on the base. The receiving module includes a substrate, a coupling radiation element disposed on the substrate and a support disposed on the substrate and having an opening. The antenna is partially exposed from the opening.
    Type: Application
    Filed: June 22, 2023
    Publication date: October 19, 2023
    Inventors: Chi-Chang LAI, Kai-Yi TANG, Mill-Jer WANG
  • Patent number: 11726122
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module, and a receiving module. The antenna module is used for holding the antenna and disposed on the housing, wherein the antenna is coupled to an antenna testing apparatus. The receiving module is disposed on the housing and includes a coupling radiation element physically separated from the antenna, wherein the receiving module is configured to receive an excited signal emitted from the antenna.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Chang Lai, Kai-Yi Tang, Mill-Jer Wang
  • Publication number: 20210405102
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module, and a receiving module. The antenna module is used for holding the antenna and disposed on the housing, wherein the antenna is coupled to an antenna testing apparatus. The receiving module is disposed on the housing and includes a coupling radiation element physically separated from the antenna, wherein the receiving module is configured to receive an excited signal emitted from the antenna.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Inventors: Chi-Chang LAI, Kai-Yi TANG, Mill-Jer WANG
  • Patent number: 9285394
    Abstract: A test apparatus includes a DUT block, at least one probe and at least one variable-length pusher. The DUT block is used for allowing the DUT to be disposed thereon. The probe is located on the DUT block. The variable-length pusher is located above the probe. The actuator is used for moving the variable-length pusher to push against the DUT to force the DUT to be in electrical contact with the probe.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: March 15, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Kai-Yi Tang
  • Publication number: 20150192610
    Abstract: A test apparatus includes a DUT block, at least one probe and at least one variable-length pusher. The DUT block is used for allowing the DUT to be disposed thereon. The probe is located on the DUT block. The variable-length pusher is located above the probe. The actuator is used for moving the variable-length pusher to push against the DUT to force the DUT to be in electrical contact with the probe.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 9, 2015
    Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
    Inventor: Kai-Yi Tang