Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a redistribution layer (RDL) module, a first semiconductor module, an interconnection module, a second semiconductor module and a molding material. The first semiconductor module is disposed on the RDL module. The interconnection module is disposed on the RDL module. The second semiconductor module is disposed on the interconnection module. The molding material covers the RDL module and surrounds the first semiconductor module and the second semiconductor module. A top surface of the first semiconductor module and a top surface of the second semiconductor module are exposed by the molding material.

Abstract: The disclosure provides a time-lapse photographic device. The time-lapse photographic device includes a camera module, a drive module, an environment detection module, and a control unit. The drive module is connected to the camera module to drive the camera module to rotate. The environment detection module is configured to detect an external environment of the time-lapse photographic device to generate an environment detection signal. The control unit is electrically connected to the camera module, the drive module, and the environment detection module. The control unit generates, according to a shooting stop parameter, a plurality of intermittent drive signals to control the drive module, and controls the camera module to shoot at intervals of the drive signals. The control unit adjusts operation of at least one of the camera module and the drive module according to the environment detection signal.

Abstract: An apparatus and a method for detecting heartbeat include a sensor configured to detect displacements of an object without contacting the object wherein the object displaces corresponding the a human's heartbeat, a data processing unit configured to extract a feature dataset from the detected displacement data, and a neural network configured to inference inter beat intervals from the extracted feature dataset using a pre-trained model.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A paper container package is provided, including: a paper layer; two plastic layers disposed on two sides of the paper layer; wherein the two plastic layers and the paper layer define at least one window which is light-penetrable in a thickness direction of the paper layer. A method for manufacturing a paper container package is provided, including steps of: preparing a paper material; partially hollowing out a part of the paper material; disposing a plastic coating on an inner side of the paper material; disposing a plastic layer on an outer side of the paper material, to form a package material; cutting the package material to form at least one paper container package; wherein the part of the paper material which is partially hollowed out, the plastic layer and the plastic coating at least partially overlap in a thickness direction of the package material.

Abstract: A protective cover for a network cable socket is disclosed. The protective cover is moveably connected to the network cable socket. The protective cover of the network cable socket comprises a housing and two elastic sheets. The housing is moveably connected to the network cable socket. Each of the elastic sheets includes a fixing portion, an extension arm, a stopper and a guiding ramp. The two extension arms are connected to the two fixing portions, respectively. The two fixing portions are fixed to two sides of the housing, respectively. The two stoppers and the two guiding ramps are formed at the two extension arms, respectively. A distance between the two guiding ramps is larger than the distance between the two stoppers.

Abstract: A container with filter is provided. The container includes a cup body, a circumferential wall and a bottom portion connecting with an end of the circumferential wall, and defines a receiving space. A filter layer is annularly connected with an inner surface of the cup body and has a movable portion disposed concavely toward the bottom portion of the cup body. A brewing material is disposed between the bottom portion and the filter layer. A heat combination device having a shape and dimension circumferentially corresponding to an interior of the cup body is also provided for producing the container.

Abstract: The method for manufacturing film-coated paper includes steps including heating and melting an original raw material composed of PP and PE and re-granulating into a second raw material, mixing a first raw material and the second raw material followed by heating, melting, and mixing again wherein the first material is PP, re-granulating the mixed material, heating and melting the re-granulated material, extruding to form a coating film, and coating the coating film on a paper surface. Thereby, a film-coated paper which can resist higher temperature and has better yield rate is provided.

Abstract: A protective cover for a network cable socket is disclosed. The protective cover is moveably connected to the network cable socket. The protective cover of the network cable socket comprises a housing and two elastic sheets. The housing is moveably connected to the network cable socket. Each of the elastic sheets includes a fixing portion, an extension arm, a stopper and a guiding ramp. The two extension arms are connected to the two fixing portions, respectively. The two fixing portions are fixed to two sides of the housing, respectively. The two stoppers and the two guiding ramps are formed at the two extension arms, respectively. A distance between the two guiding ramps is larger than the distance between the two stoppers.

Abstract: A sole structure with magnetic cushion includes an outsole; a midsole main body located on a top of the outsole and having a recess formed at a heel portion thereof; a magnetic cushion positioned in the recess of the midsole main body; a foam rubber layer located on a top of the midsole main body to sandwich the magnetic cushion between the foam rubber layer and the midsole main body; and an insole located on a top of the foam rubber layer for directly contacting with a user's foot. The magnetic cushion includes sequentially laminated first magnetic element, foam rubber spacer, and second magnetic element, and the first magnetic element and the second magnetic element are arranged with their poles of the same polarity facing toward each other, so that a magnetic repulsion is existed between the first and second magnetic elements to provide good buffering and cushioning effect.