Patents by Inventor Kai-yu JIANG
Kai-yu JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11930318Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.Type: GrantFiled: June 23, 2021Date of Patent: March 12, 2024Assignee: Merry Electronics Co., Ltd.Inventors: Yueh-Kang Lee, Jen-Yi Chen, Kai-Yu Jiang
-
Patent number: 11671735Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: GrantFiled: July 31, 2022Date of Patent: June 6, 2023Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
-
Patent number: 11561129Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.Type: GrantFiled: July 21, 2021Date of Patent: January 24, 2023Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
-
Publication number: 20220404196Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.Type: ApplicationFiled: July 21, 2021Publication date: December 22, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
-
Patent number: 11509984Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: GrantFiled: January 25, 2021Date of Patent: November 22, 2022Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
-
Publication number: 20220369012Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: ApplicationFiled: July 31, 2022Publication date: November 17, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
-
Publication number: 20220298010Abstract: Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.Type: ApplicationFiled: November 26, 2021Publication date: September 22, 2022Applicant: Merry Electronics Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang
-
Publication number: 20220303667Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.Type: ApplicationFiled: June 23, 2021Publication date: September 22, 2022Applicant: Merry Electronics Co., Ltd.Inventors: Yueh-Kang Lee, Jen-Yi Chen, Kai-Yu Jiang
-
Publication number: 20220191605Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: ApplicationFiled: January 25, 2021Publication date: June 16, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
-
Patent number: 11223908Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.Type: GrantFiled: September 7, 2020Date of Patent: January 11, 2022Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Kai-Yu Jiang, Jen-Yi Chen, Yueh-Kang Lee
-
Publication number: 20210409873Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.Type: ApplicationFiled: September 7, 2020Publication date: December 30, 2021Inventors: Kai-Yu JIANG, Jen-Yi CHEN, Yueh-Kang LEE
-
Patent number: 10972840Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.Type: GrantFiled: June 26, 2019Date of Patent: April 6, 2021Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang, Chao-Sen Chang
-
Patent number: 10710868Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.Type: GrantFiled: January 31, 2019Date of Patent: July 14, 2020Assignee: Merry Electronics (Shenzhen) Co., Ltd.Inventors: Kai-Yu Jiang, Jen-Yi Chen, Chao-Sen Chang
-
Patent number: 10680535Abstract: A vertical comb-drive actuator comprising a support base and a movable body is described. The support base comprises first comb electrodes and a first surface wherein the first comb electrodes extend from the first surface. The movable body attached to the support base comprises second comb electrodes and a second surface wherein the second comb electrodes extend from the second surface. The movable body may rotate about a rotation axis and the first comb electrodes are interdigitated with the second comb electrodes correspondingly. The second comb electrodes extend along a first direction, the rotation axis extends along a second direction, and the first comb electrodes extend along a third direction. The distance between the first lateral face of the first comb electrode and the second surface is shorter than the second length defined as the distance between the end surface of the second comb electrode and the second surface.Type: GrantFiled: August 10, 2016Date of Patent: June 9, 2020Assignee: OPUS MICROSYSTEMS CORPORATIONInventors: Chang-li Hung, Ta-wei Lin, Kai-yu Jiang
-
Publication number: 20200177996Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.Type: ApplicationFiled: June 26, 2019Publication date: June 4, 2020Inventors: Jen-Yi CHEN, Yueh-Kang LEE, Kai-Yu JIANG, Chao-Sen CHANG
-
Publication number: 20200131024Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.Type: ApplicationFiled: January 31, 2019Publication date: April 30, 2020Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Kai-Yu Jiang, Jen-Yi Chen, Chao-Sen Chang
-
Patent number: 10638235Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.Type: GrantFiled: October 17, 2018Date of Patent: April 28, 2020Assignee: Merry Electronics (Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang
-
Patent number: 10609491Abstract: A speaker includes a diaphragm and a MEMS actuator. The MEMS actuator includes a coupling member attached to the diaphragm and at least one closed cantilever ring that is surrounded around and connected to the coupling member by plural first bridge members, wherein the closed cantilever ring is configured to be electrically-biased to cause an axial movement of the coupling member and the diaphragm.Type: GrantFiled: March 11, 2019Date of Patent: March 31, 2020Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Kai-Yu Jiang, Jen-Yi Chen, Vel Sankar Ramachandran
-
Publication number: 20200092655Abstract: A speaker includes a diaphragm and a MEMS actuator. The MEMS actuator includes a coupling member attached to the diaphragm and at least one closed cantilever ring that is surrounded around and connected to the coupling member by plural first bridge members, wherein the closed cantilever ring is configured to be electrically-biased to cause an axial movement of the coupling member and the diaphragm.Type: ApplicationFiled: March 11, 2019Publication date: March 19, 2020Inventors: Kai-Yu JIANG, Jen-Yi CHEN, Vel Sankar RAMACHANDRAN
-
Publication number: 20200059734Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.Type: ApplicationFiled: October 17, 2018Publication date: February 20, 2020Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang