Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A generating method of conference image and an image conference system are provided. In the method, a user and one or more tags in a captured actual image are identified. The moving behavior of the user is tracked, and the position of the viewing range in the actual image is adjusted according to the moving behavior. The virtual image corresponding to the tag is synthesized according to the position relation between the user and the tag, to generate a conference image.

Abstract: An interaction method between reality and virtuality and an interaction system between reality and virtuality are provided in the embodiments of the present invention. A marker is provided on a controller. A computing apparatus is configured to determine control position information of the controller in a space according to the marker in an initial image captured by an image capturing apparatus; determine object position information of a virtual object image in the space corresponding to the marker according to the control position information; and integrate the initial image and the virtual object image according to the object position information, to generate an integrated image. The integrated image is used to be played on a display. Accordingly, an intuitive operation is provided.