Abstract: The present invention provides a composition, comprising ferrous amino acid chelate particles sintered from ferrous amino acid chelate, wherein the average particle size of the ferrous amino acid chelate particles ranges from 500 nm to 2600 nm, and the average molecular weight of the particles ranges from 1,500 Dalton to 600,000 Dalton. Besides, the present invention can be used for manufacturing a medicament for treating or ameliorating a pancreas-related disease, wherein the medicament comprises an effective amount of the composition and a pharmaceutically acceptable carrier.

Abstract: Apparatus and methods to provide electronic devices comprising tungsten film stacks are provided. A tungsten liner formed by physical vapor deposition is filled with a tungsten film formed by chemical vapor deposition directly over the tungsten liner.

Abstract: A display device includes a display panel including a plurality of gate lines and a plurality of data lines, the plurality of gate lines intersecting and being insulated with the plurality of data lines, the display panel further including a plurality of sub-pixels arranged in an array, and the plurality of gate lines and the plurality of data lines defining areas where the sub-pixels are located; a gate driver electrically connected to the plurality of gate lines in the display panel; and a source driver bound to the display panel and electrically connected to the plurality of data lines in the display panel, the source driver being configured to set data transmission start time for respective data lines so that effective charging time of respective sub-pixels formed by the plurality of data lines and a same gate line is same.

Abstract: In some embodiments, the present disclosure relates to a method of forming a metal-insulator-metal (MIM) device. The method may be performed by depositing a bottom electrode layer over a substrate, depositing a dielectric layer over the bottom electrode layer, depositing a top electrode layer over the dielectric layer, and depositing a first titanium getter layer over the top electrode layer. The first titanium getter layer, the top electrode layer, and the dielectric layer are patterned to expose a peripheral portion of the bottom electrode layer. A passivation layer is deposited over the substrate, the first titanium getter layer, and the peripheral portion of the bottom electrode layer.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A bonded assembly may be formed by providing at least a first packaging substrate in a low-oxygen ambient; providing at least a first semiconductor package in the low-oxygen ambient; performing a first plasma package-treatment process on the first semiconductor package in the low-oxygen ambient by directing at least one first plasma jet to first solder material portions bonded to the first semiconductor package; and bringing the first solder material portions onto, or in proximity to, first substrate-side bonding structures located on the first packaging substrate while the at least one first plasma jet is directed to the first solder material portions. The first substrate-side bonding structures are treated with the first plasma jet. The first semiconductor package is bonded to the first packaging substrate while, or after, the first substrate-side bonding structures are treated with the first plasma jet.

Abstract: A bonded assembly may be formed by providing a wafer comprising at least a first packaging substrate and a second packaging substrate in a low-oxygen ambient; performing a first plasma package-treatment process on the first semiconductor package in the low-oxygen ambient while performing a first substrate-treatment process on the first packaging substrate in a low-oxygen ambient having an oxygen partial pressure that is lower than 17 kPa; and performing a second plasma package-treatment process on the second semiconductor package while performing a second substrate-treatment process on the second packaging substrate and while bonding the first semiconductor package to the first packaging substrate.

Abstract: A self-ligating bracket, a double-wing spacing adjustable bracket and a dental appliance are described. The self-ligating bracket includes a bracket base plate, a first elastic support, a bracket body, and a position-limited member. A first end of the first elastic support is connected to the bracket base plate. The bracket body has a hollow structure. A second end of the first elastic support is connected to a distal end of the bracket body. The distal end of the bracket body is provided with a distal-end gap. The distal end of the bracket body is expanded radially by the second end of the first elastic support. The position-limited member is movable in an axial direction of the bracket body, and the position-limited member is sleeved on an outside of the bracket body for overcoming elastic force provided by the first elastic support and making the bracket body contract in a radial direction.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: Miltefosine is utilized to enhance immune response to vaccination, for example an influenza and/or coronavirus vaccination. The inventive subject matter also provides compositions and methods for enhancing viral yield in cultured cells, by application of a cannabinoid receptor agonist (such as methanandamide) to such cells. Such enhanced viral yield can be used to enhance virus production for purposes of vaccine formulation and/or to improve sensitivity of cell-based virus assays.

Abstract: A method includes: forming a fin protruding from a substrate; implanting an n-type dopant in the fin to form an n-type channel region; implanting a p-type dopant in the fin to form a p-type channel region adjacent the n-type channel region; forming a first gate structure over the n-type channel region and a second gate structure over the p-type channel region; forming a first epitaxial region in the fin adjacent a first side of the first gate structure; forming a second epitaxial region in the fin adjacent a second side of the first gate structure and adjacent a first side of the second gate structure; and forming a third epitaxial region in the fin adjacent a second side of the second gate structure.

Abstract: An automatic loading system for vehicles includes an overhead platform, a transporting machine, and a cargo carrying mechanism. The overhead platform includes two rails. The transporting machine is disposed on the rails and configured to move on the rails along a first direction. The transporting machine includes a hoist mechanism and a fork assembly disposed on the hoist mechanism. The hoist mechanism is configured to drive the fork assembly to move along a second direction which is perpendicular to the first direction. The fork assembly includes forks disposed side by side and separately. Each fork includes at least a conveyer belt. The cargo carrying mechanism is configured to carry cargos and includes a conveyer belt platform. When the fork assembly is close to the cargo carrying mechanism, the conveyer belt and the conveyer belt platform are configured to transport the cargos to the forks from the conveyer belt platform.

Abstract: In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.

Abstract: The present disclosure relates to the field of hydrogel technology, and specifically relates to a small molecule melphalan hydrogel and a preparation method thereof. The small molecule melphalan hydrogel is made of melphalan drug or melphalan hydrochloride as raw materials, and it is formed at room temperature or physiological condition by means of making the melphalan drug in a hydrophilic solvent. The hydrophilic solvent includes any one of physiological saline, pure water, and phosphate buffered saline solution. The small molecule melphalan hydrogel provided by the present disclosure is an injectable hydrogel of 100% pure melphalan drug, the gel only contains small molecule melphalan drug, which solves the problems of containing a large amount of carrier materials and having a low drug loading rate in the field of hydrogel.

Abstract: Methods of preventing and treating PKD and its complications using antibody activators that bind to the (Na++K+)-ATPase.

Abstract: Disclosed are non-transitory computer-readable media, systems, and computer-implemented methods that describe obtaining hot spot (HS) location information with respect to a printed pattern; obtaining LFP search criteria for searching the printed pattern to determine a local focus point (LFP) for an imaging device; selecting a HS area in the printed pattern that contains a HS; and determining the LFP proximate to the HS area based on the LFP search criteria, the LFP not containing the HS.

Abstract: A method for training a segmentation model is provided. The method includes using first training images to train a segmentation model. The method includes using second training images to train an image generator. The method includes inputting real images into the segmentation model to generate predicted annotation images. The method includes inputting the predicted annotation images into the image generator to generate fake images. The method includes updating the segmentation model and the image generator according to a loss caused by differences between the real images and the fake images.

Abstract: The present invention provides a test device. The device includes a testing element and a house configured to accommodate the testing element, where the house is formed by folding a paper-made card, and the testing element is located in the housing. The housing is allowed to be in different change states to test or assay an analyte in a sample.