Patents by Inventor Kaichi Ueno

Kaichi Ueno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9033468
    Abstract: An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: May 19, 2015
    Assignee: RICOH COMPANY, LTD.
    Inventors: Kouji Ohnishi, Takahiko Kuroda, Manabu Nishimura, Kaichi Ueno
  • Publication number: 20140267506
    Abstract: An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventors: Kouji Ohnishi, Takahiko KURODA, Manabu NISHIMURA, Kaichi UENO
  • Patent number: 8523330
    Abstract: A recording apparatus includes a liquid droplet discharging head and a tank. The liquid droplet discharging head discharges a liquid droplet. The tank supplies a liquid to the liquid droplet discharging head. The liquid droplet discharging head includes a liquid droplet discharging head circuit board including a board substrate and a writing pattern. The wiring pattern is located on the board substrate to supply power and includes a plurality of divided wiring patterns formed by dividing at least a part of the wiring pattern in a width direction of the wiring pattern.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: September 3, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Kaichi Ueno
  • Patent number: 7950770
    Abstract: This patent specification describes a droplet-ejecting head including a nozzle substrate having a plurality of nozzles for ejecting droplets, and an actuator configured to be driven to generate energy for ejecting droplets through each nozzle. The nozzle substrate is cleaned by a cleaning liquid containing microbubbles before being bonded to another member.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: May 31, 2011
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshiroh Tokuno, Michio Umezawa, Kaichi Ueno, Kouji Ohnishi
  • Publication number: 20070222812
    Abstract: This patent specification describes a droplet-ejecting head including a nozzle substrate having a plurality of nozzles for ejecting droplets, and an actuator configured to be driven to generate energy for ejecting droplets through each nozzle. The nozzle substrate is cleaned by a cleaning liquid containing microbubbles before being bonded to another member.
    Type: Application
    Filed: February 22, 2007
    Publication date: September 27, 2007
    Inventors: Toshiroh Tokuno, Michio Umezawa, Kaichi Ueno, Kouji Ohnishi
  • Publication number: 20070176975
    Abstract: A recording apparatus includes a liquid droplet discharging head and a tank. The liquid droplet discharging head discharges a liquid droplet. The tank supplies a liquid to the liquid droplet discharging head. The liquid droplet discharging head includes a liquid droplet discharging head circuit board including a board substrate and a writing pattern. The wiring pattern is located on the board substrate to supply power and includes a plurality of divided wiring patterns formed by dividing at least a part of the wiring pattern in a width direction of the wiring pattern.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 2, 2007
    Inventor: Kaichi Ueno
  • Patent number: 5847466
    Abstract: A semiconductor device having a multilayer interconnection structure, includes a substrate having a metal interconnect layer provided thereon and N number (N being an integer of 2 or greater) of layers of insulating film formed one on top of another on the substrate. Each layer of insulating film has a metal interconnect layer including at least one bonding pad section provided thereon. At least one via hole filled with an electrically conductive material is provided in each of the layers for interconnecting metal interconnect layers. At least one bonding pad connecting hole filled with an electrically conductive material is provided in each of the layers for interconnecting bonding pad sections. The at least one bonding pad connecting hole is no more than twice as large in diameter as a smallest via hole.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: December 8, 1998
    Assignee: Ricoh Company, Ltd.
    Inventors: Kazunori Ito, Mitsugu Irinoda, Kaichi Ueno, Mamoru Ishida, Takahiko Kuroda