Patents by Inventor Kaichiro Haruta

Kaichiro Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200377772
    Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.
    Type: Application
    Filed: April 19, 2018
    Publication date: December 3, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kaichiro HARUTA, Takashi UNEZAKI, Kiyomi IMAGAWA, Kenichi FUJII, Yasuhisa KAYABA, Kazuo KOHMURA
  • Publication number: 20200181457
    Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.
    Type: Application
    Filed: July 10, 2018
    Publication date: June 11, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Jun KAMADA, Tomoya MATAYOSHI, Michio ERIGUCHI, Kaichiro HARUTA, Kenichi FUJII, Takashi UNEZAKI, Kazuo KOHMURA
  • Publication number: 20200168476
    Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 28, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kaichiro HARUTA, Yasuhisa KAYABA, Kazuo KOHMURA, Yoichi KODAMA
  • Patent number: 9227950
    Abstract: A non-aqueous electrolyte solution containing a cyclic sulfate compound represented by formula (I) is provided, wherein in formula (I), R1 represents a group represented by formula (II) or a group represented by formula (III); R2 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, a group represented by formula (II), or a group represented by formula (III); and in formula (II), R3 represents a halogen atom, an alkyl group having from 1 to 6 carbon atoms, a halogenated alkyl group having from 1 to 6 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, or a group represented by formula (IV).
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: January 5, 2016
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shigeru Mio, Mitsuo Nakamura, Kaichiro Haruta, Hidenobu Nogi, Satoko Fujiyama, Takashi Hayashi, Hidetoshi Tsunoda
  • Publication number: 20130171514
    Abstract: A non-aqueous electrolyte solution containing a cyclic sulfate compound represented by formula (I) is provided, wherein in formula (I), R1 represents a group represented by formula (II) or a group represented by formula (III); R2 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, a group represented by formula (II), or a group represented by formula (III); and in formula (II), R3 represents a halogen atom, an alkyl group having from 1 to 6 carbon atoms, a halogenated alkyl group having from 1 to 6 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, or a group represented by formula (IV).
    Type: Application
    Filed: October 21, 2011
    Publication date: July 4, 2013
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Shigeru Mio, Mitsuo Nakamura, Kaichiro Haruta, Hidenobu Nogi, Satoko Fujiyama, Takashi Hayashi, Hidetoshi Tsunoda