Abstract: An asking apparatus includes a load-lock chamber and an apparatus control unit. The load-lock chamber takes in or out a semiconductor wafer to or from a process chamber in which a vacuum process of the semiconductor wafer is performed. The apparatus control unit controls a venting process for putting the load-lock chamber in a vacuum state to an atmospheric state in which the load-lock chamber is opened to atmosphere. Also, the apparatus control unit compares ?1 kPa that is a pressure value previously set and a differential pressure value obtained by subtracting a second pressure value that is a pressure inside the load-lock chamber right after venting to the atmosphere from a first pressure value that is a pressure inside the load-lock chamber right before venting. The apparatus control unit outputs an alarm when the differential pressure value is lower than ?1 kPa that is a pressure value previously set.

Abstract: A semiconductor device manufacturing method which uses a FOUP capable of suppressing semiconductor substrate defects due to outgas. The FOUP includes: a main body having an opening for taking in or out a semiconductor wafer; a cover detachably attached to the main body in close contact with the main body in a manner to cover the opening; an intake hole and an exhaust hole which are formed in the main body; and a first filter provided on the intake hole and a second filter provided on the exhaust hole. With the semiconductor wafer housed in the internal space of the main body, the FOUP is ventilated by taking external air into the internal space from the intake hole through the first filter and taking the air in the internal space out of the main body from the exhaust hole.

Abstract: A semiconductor manufacturing apparatus capable of stable operation includes a processing chamber where a wafer is treated, a vacuum pump that is coupled with the processing chamber and evacuates the processing chamber, a monitor that measures the drive state of the vacuum pump, and an exhaust assisting device that is arranged on the exhaust side of the vacuum pump, in which the monitor measures the drive state of the vacuum pump in a state the vacuum pump and the exhaust assisting device are driven.