Patents by Inventor Kaichiro Nakamuro

Kaichiro Nakamuro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
    Patent number: 9730332
    Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: August 8, 2017
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Surface treated copper foil and laminate using the same
    Patent number: 9504149
    Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: November 22, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board
    Publication number: 20160303829
    Abstract: A surface treated copper foil which allows the resin to have excellent transparency after removal of the copper foil by etching is provided. The surface treated copper foil has one surface and other surface each surface treated. An Sv defined by the following expression (1) is 3.5 or more: Sv=(?B×0.1)/(t1?t2)??(1) which is determined, after laminating one surface to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, and photographing a printed matter with a linear mark, from the resulting observation spot versus brightness graph; and the surface treated other surface of the copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.35 ?m or more.
    Type: Application
    Filed: December 10, 2014
    Publication date: October 20, 2016
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Surface treated copper foil and laminate using the same
    Patent number: 9232650
    Abstract: A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of ?0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=(?B×0.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: January 5, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Surface Treated Copper Foil and Laminate Using the Same
    Publication number: 20150245477
    Abstract: A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of ?0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=(?B×0.
    Type: Application
    Filed: November 11, 2013
    Publication date: August 27, 2015
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE
    Publication number: 20150237737
    Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.
    Type: Application
    Filed: November 11, 2013
    Publication date: August 20, 2015
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Surface Treated Copper Foil and Laminate Using the Same
    Publication number: 20140355229
    Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.
    Type: Application
    Filed: November 11, 2013
    Publication date: December 4, 2014
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro