Abstract: The invention discloses a cattle shed, comprising a cattle bedding, a feeding channel, a fixed roof, a movable roof, a feeding trough, a peripheral rail fence, and a rail fence gate, wherein the cattle bedding is provided with no dividers and needs no hardening and daily manure cleaning, which is merged with playground and enclosed. The feeding channel is hardened and higher than the cattle bedding, the fixed roof and the movable roof cover the cattle bedding and the feeding trough, the peripheral rail fence and the rail fence gate surround the cattle bedding and the feeding trough, and the fixed roof and the movable roof are arranged in a slope mode, and the movable roof can be opened to allow sunlight to enter and exchange air to form convection. The cattle shed of the present invention can reduce the construction cost, open the movable roof, effectively utilize the sunlight and the air convection, ensure a complete rain-sewage separation, and realize zero discharge of manure and sewage.

Abstract: Provided is a spectroscopic measurement device capable of improving detection sensitivity to a change in a physical property value such as expansion of a sample to which energy is applied by an infrared ray or the like. The spectroscopic measurement device includes: a stage on which a sample is to be placed; an energy source configured to generate an energy beam to be emitted to a predetermined region of the sample; an electromagnetic wave source configured to generate an electromagnetic wave to be emitted to the sample; an objective lens configured to focus the electromagnetic wave in the predetermined region; two confocal detectors configured to detect the electromagnetic wave reflected by the sample; and a calculation unit configured to calculate, based on each of outputs of the confocal detectors, a change in a physical property value of the sample when the energy beam is emitted to the predetermined region.

Abstract: Provided is a spectrometry apparatus that suppresses a reduction in usage efficiency of an irradiation energy of a light. A spectrometry apparatus of the disclosure includes a stage on which a sample is placed, an electromagnetic source that emits an electromagnetic wave, one or a plurality of optical elements that transform a spatial energy distribution of the electromagnetic wave and emit the electromagnetic wave, and a reflective objective lens that collects the electromagnetic wave after a transformation of the spatial energy distribution and irradiates the sample with the collected electromagnetic wave.

Abstract: To enhance the measurement sensitivity of a scanning probe microscope. In a cross sectional view, a cantilever includes a vertex portion that is a portion close to a sample and is covered by a metallic film, a ridge that is connected to the vertex portion and is covered by the metallic film, and an upper corner portion that is connected to the ridge. Here, the upper corner portion and a part of the ridge are portions to be irradiated with excitation light emitted from a light source of the scanning probe microscope.

Abstract: The number of agents to which incoming queries to a customer interaction center agent group may be distributed is limited based on skip criteria. The skip criteria is defined based on information associated with agent devices, such as locked status of a device, in-memory status of a client application at the device, or whether a telephone number provisioned for use with the device is from an external public switched telephone network. Agents which fail to satisfy the skip criteria are excluded from distributions of queries to improve wait times for customer interaction center users. Thus, queries are distributed from a queue to agents which satisfy the skip criteria.

Abstract: To enhance the measurement sensitivity of a scanning probe microscope. In a cross sectional view, a cantilever includes a vertex portion that is a portion close to a sample and is covered by a metallic film, a ridge that is connected to the vertex portion and is covered by the metallic film, and an upper corner portion that is connected to the ridge. Here, the upper corner portion and a part of the ridge are portions to be irradiated with excitation light emitted from a light source of the scanning probe microscope.

Abstract: The present disclosure provides a centralized power meter for a signal processing circuit, comprising: M sample buffers, each configured to buffer samples respectively from at least one of N sources, and trigger a request for power calculation of the buffered samples in response to the buffered samples, the request having a corresponding priority; a switch, configured to route the requests from the M sample buffers to one or more power calculation cores; the one or more power calculation cores, each configured to retrieve the samples from the sample buffer in an order of their corresponding priorities, in response to the routed requests, and to perform power calculation of the retrieved samples, wherein N and M are integers no less than 1, and N is no less than M. The present disclosure further provides a centralized power calculation method.

Abstract: A near-field scanning probe includes: a measurement probe that relatively scans a test sample; an excitation light irradiation system; a near-field light generation system that generates near-field light in a region including the measurement probe in response to irradiation with excitation light from the excitation light irradiation system; and a scattered light detection system that detects Rayleigh scattering and Ramen scattered light of the near-field light from the sample, generated between the measurement probe and the sample, and the near-field scanning probe is characterized in that the near-field light generation system includes a cantilever with a chip coated with a noble metal, and a tip of the chip is provided with a thin wire group including a plurality of carbon nanowires with a noble metal provided at ends thereof.

Abstract: Detection can be performed even for a thick inspection target object through time delay integration without degradation of spatial resolution. There is provided an X-ray inspection device configured to include: an X-ray source that generates X-rays; a transport unit that performs transporting a sample; a detecting unit that has a time delay integration type detector which detects X-rays generated by the X-ray source and transmitted through the sample transported by the transport unit; and a defect determining unit that processes a signal obtained by detecting the X-rays transmitted through the sample by the time delay integration type detector of the detecting unit and determines a defect in the sample. The transport unit performs transporting the sample while causing the sample to rotate in synchronization with the transporting when the sample passes in front of the time delay integration type detector of the detecting unit.

Abstract: A near-field scanning probe includes: a measurement probe that relatively scans a test sample; an excitation light irradiation system; a near-field light generation system that generates near-field light in a region including the measurement probe in response to irradiation with excitation light from the excitation light irradiation system; and a scattered light detection system that detects Rayleigh scattering and Ramen scattered light of the near-field light from the sample, generated between the measurement probe and the sample, and the near-field scanning probe is characterized in that the near-field light generation system includes a cantilever with a chip coated with a noble metal, and a tip of the chip is provided with a thin wire group including a plurality of carbon nanowires with a noble metal provided at ends thereof.

Abstract: A near-field scanning probe includes: a measurement probe that relatively scans a test sample; an excitation light irradiation system; a near-field light generation system that generates near-field light in a region including the measurement probe in response to irradiation with excitation light from the excitation light irradiation system; and a scattered light detection system that detects Rayleigh scattering and Ramen scattered light of the near-field light from the sample, generated between the measurement probe and the sample, and the near-field scanning probe is characterized in that the near-field light generation system includes a cantilever with a chip coated with a noble metal, and a tip of the chip is provided with a thin wire group including a plurality of carbon nanowires with a noble metal provided at ends thereof.

Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.

Abstract: A near-field scanning probe includes: a measurement probe that relatively scans a test sample; an excitation light irradiation system; a near-field light generation system that generates near-field light in a region including the measurement probe in response to irradiation with excitation light from the excitation light irradiation system; and a scattered light detection system that detects Rayleigh scattering and Ramen scattered light of the near-field light from the sample, generated between the measurement probe and the sample, and the near-field scanning probe is characterized in that the near-field light generation system includes a cantilever with a chip coated with a noble metal, and a tip of the chip is provided with a thin wire group including a plurality of carbon nanowires with a noble metal provided at ends thereof.

Abstract: The present disclosure provides a centralized power meter for a signal processing circuit, comprising: M sample buffers, each configured to buffer samples respectively from at least one of N sources, and trigger a request for power calculation of the buffered samples in response to the buffered samples, the request having a corresponding priority; a switch, configured to route the requests from the M sample buffers to one or more power calculation cores; the one or more power calculation cores, each configured to retrieve the samples from the sample buffer in an order of their corresponding priorities, in response to the routed requests, and to perform power calculation of the retrieved samples, wherein N and M are integers no less than 1, and N is no less than M. The present disclosure further provides a centralized power calculation method.

Abstract: Detection can be performed even for a thick inspection target object through time delay integration without degradation of spatial resolution. There is provided an X-ray inspection device configured to include: an X-ray source that generates X-rays; a transport unit that performs transporting a sample; a detecting unit that has a time delay integration type detector which detects X-rays generated by the X-ray source and transmitted through the sample transported by the transport unit; and a defect determining unit that processes a signal obtained by detecting the X-rays transmitted through the sample by the time delay integration type detector of the detecting unit and determines a defect in the sample. The transport unit performs transporting the sample while causing the sample to rotate in synchronization with the transporting when the sample passes in front of the time delay integration type detector of the detecting unit.

Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.

Abstract: An integrated sidetrack drilling tool comprising a milling cone, a whipstock iron and a setting anchor; a liquid guiding pipe communicating the milling cone and the setting anchor is provided inside the whipstock iron; the milling cone presses against an inclined surface of the whipstock iron; an annular groove is provided on a circumference of the milling cone; a portion of the annular groove is an arc shaped clamping slot whose inner side is wider than outer side; other portions of the annular groove constitute a trapezoidal slot whose inner side is narrower than outer side; a portion of the whipstock iron is fixedly provided with a positioning block; an arc shaped clamping edge is provided on the positioning block; the positioning block is held in the arc shaped clamping slot via the arc shaped clamping edge; a positioning screw is provided between the whipstock iron and the milling cone.

Abstract: To detect near-field light, which is generated by a thermal assist type magnetic head element, and leaking light with high sensitivity and to more accurately obtain the spatial intensity distribution of a near-field light generation area, an inspection apparatus for a thermal assist type magnetic head element is adapted so that a distance between a cantilever and the surface of a specimen and the excitation amplitude of the cantilever are set to be small to detect near-field light with high sensitivity by the suppression of an influence of other light components, a distance between the cantilever and the surface of the specimen and the excitation amplitude of the cantilever are set to be large to detect other light components present in the vicinity of near-field light with high sensitivity by the suppression of an influence of the amount of detected near-field light when other light components are measured.

Abstract: An X-ray transmission inspection apparatus is provided with: an X-ray source configured to irradiate a sample with an X-ray; a sample moving mechanism configured to continuously move the sample in a specific direction during irradiation with the X-ray from the X-ray source; a TDI sensor disposed at a side opposite to the X-ray source with the sample interposed therebetween and configured to detect the X-ray transmitted by the sample; and a polycapillary disposed between the X-ray source and the sample and configured to convert the X-ray radially emitted from the X-ray source into a parallel X-ray parallel to a thickness direction of the sample.

Abstract: To detect near-field light, which is generated by a thermal assist type magnetic head element, and leaking light with high sensitivity and to more accurately obtain the spatial intensity distribution of a near-field light generation area, an inspection apparatus for a thermal assist type magnetic head element is adapted so that a distance between a cantilever and the surface of a specimen and the excitation amplitude of the cantilever are set to be small to detect near-field light with high sensitivity by the suppression of an influence of other light components, a distance between the cantilever and the surface of the specimen and the excitation amplitude of the cantilever are set to be large to detect other light components present in the vicinity of near-field light with high sensitivity by the suppression of an influence of the amount of detected near-field light when other light components are measured.