Patents by Inventor Kaigham Gabriel

Kaigham Gabriel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7089069
    Abstract: Each of a plurality of speaklets (MEMS membranes) produces a stream of clicks (discrete pulses of acoustic energy) that are summed to generate the desired soundwave. The speaklets are selected to be energized based on the value of a digital signal. The greater the significance of the bit of the digital signal, the more speaklets that are energized in response to that bit. Thus, a time-varying sound level is generated by time-varying the number of speaklets emitting clicks. Louder sound is generated by increasing the number of speaklets emitting clicks. The present invention represents a substantial advance over the prior art in that sound is generated directly from a digital signal without the need to convert the digital signal first to an analog signal for driving a diaphragm.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: August 8, 2006
    Assignee: Carnegie Mellon University
    Inventors: Kaigham Gabriel, John J. Neumann, Jr., Brett M. Diamond
  • Publication number: 20050061770
    Abstract: An acoustic transducer comprising a substrate; and a diaphragm formed by depositing a micromachined membrane onto the substrate. The diaphragm is formed as a single silicon chip using a CMOS MEMS (microelectromechanical systems) semiconductor fabrication process. The curling of the diaphragm during fabrication is reduced by depositing the micromachined membrane for the diaphragm in a serpentine-spring configuration with alternating longer and shorter arms. As a microspeaker, the acoustic transducer of the present invention converts a digital audio input signal directly into a sound wave, resulting in a very high quality sound reproduction at a lower cost of production in comparison to conventional acoustic transducers. The micromachined diaphragm may also be used in microphone applications.
    Type: Application
    Filed: September 20, 2004
    Publication date: March 24, 2005
    Inventors: John Neumann, Kaigham Gabriel
  • Publication number: 20050013455
    Abstract: An acoustic transducer comprising a substrate; and a diaphragm formed by depositing a micromachined membrane onto the substrate. The diaphragm is formed as a single silicon chip using a CMOS MEMS (microelectromechanical systems) semiconductor fabrication process. The curling of the diaphragm during fabrication is reduced by depositing the micromachined membrane for the diaphragm in a serpentine-spring configuration with alternating longer and shorter arms. As a microspeaker, the acoustic transducer of the present invention converts a digital audio input signal directly into a sound wave, resulting in a very high quality sound reproduction at a lower cost of production in comparison to conventional acoustic transducers. The micromachined diaphragm may also be used in microphone applications.
    Type: Application
    Filed: February 18, 2004
    Publication date: January 20, 2005
    Inventors: Wayne Loeb, John Neumann, Kaigham Gabriel
  • Publication number: 20050000932
    Abstract: The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer.
    Type: Application
    Filed: July 30, 2004
    Publication date: January 6, 2005
    Inventors: Kaigham Gabriel, Xu Zhu