Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.

Abstract: The analytical process utilized in the system of this invention comprises three (3) step distinct steps wherein an analyte of interest in a test sample is initially labeled and subsequently isolated within a porous medium of a test device. Once isolated within the medium, the label is displaced from the analyte, or from the complex with the analyte, and converted, under electrolytic condition, to a metallic species which is caused test to deposit upon a working electrode of the test device. This working electrode is part of an electrode array that is positioned coincident with the porous medium, yet maintained physically remote therefrom. This deposit is then stripped from the working electrode, under anodic stripping conditions, and the current generated within the electrode array monitored. The characteristic response curve that is produced thereby can be correlated with the identity and concentration of the analyte(s) with the test sample.

Abstract: A system and method for the selective electrochemical analysis of an aqueous test sample for an analyte of interest, with biosensor comprising a working electrode comprising (a) an effective amount of oxidase enzyme specific for the analyte of interest, and (b) a metal catalysts doped carbon composition specific for the catalytic reduction of hydrogen peroxide liberated from enzymatic action of said oxidase upon the analyte of interest. The system and method of this invention effectively perform such selective electrochemical analysis in the presence of common interferents (e.g. acetaminophen, uric and ascorbic acids, catecholamines) at relative low voltages (from about +0.3 to −0.25V), so as to avoid generation of an overlapping signal from such interferents.

Abstract: A hydrophilic emulsion composition as a carrier fluid for the oral administration of biologically active polypeptides. The composition consists of a commercial therapeutic polypeptide product, e.g., Granulocyte Colony Stimulating Factor (G-CSF), and a carrier fluid containing a small molecule spleen extract and a fluid mixture of substances that are complimentary to said small molecule extract to protect the polypeptide and promote the absorption of the polypeptide by epithelium of intestinal mucosa.

Abstract: System, method, and test strip for solid phase, electrochemical, quantitative analysis of analytes contained in biological fluid samples. Preliminary to analysis, a test sample solution can be applied to a sample collection pad associated with the solid phase test environment of the test strip. The test sample solution and a test kit reagent are thereby initially contacted, under assay conditions, within this solid phase test environment, and caused to migrate along a fluid pathway therein. Irrespective of the assay format (competitive assay, sandwich assay, etc.), a test kit reagent (e.g. labeled substance) and the analyte of interest (e.g.