Patents by Inventor Kaijie Wang

Kaijie Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12284484
    Abstract: A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: April 22, 2025
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Kaijie Wang, Zhuanzhuan Zhao
  • Patent number: 12284473
    Abstract: The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: April 22, 2025
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Zhuanzhuan Zhao, Kaijie Wang, Linlin Wang, Rui Zhang
  • Publication number: 20250126386
    Abstract: The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.
    Type: Application
    Filed: August 25, 2022
    Publication date: April 17, 2025
    Inventors: Zhuanzhuan Zhao, Kaijie Wang, Linlin Wang, Rui Zhang
  • Patent number: 12267650
    Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: April 1, 2025
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Linlin Wang, Rui Zhang, Kaijie Wang, Zhuanzhuan Zhao, Minh Ngoc Nguyen
  • Patent number: 12267649
    Abstract: A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: April 1, 2025
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Kaijie Wang, Zhuanzhuan Zhao
  • Publication number: 20250106560
    Abstract: An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.
    Type: Application
    Filed: December 22, 2023
    Publication date: March 27, 2025
    Inventors: Zhuanzhuan Zhao, Kaijie Wang, Rui Zhang
  • Publication number: 20250042722
    Abstract: The present disclosure discloses a MEMS microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.
    Type: Application
    Filed: June 7, 2022
    Publication date: February 6, 2025
    Inventors: Zhuanzhuan Zhao, Zhengyu Shi, Kaijie Wang, Linlin Wang, Rui Zhang
  • Patent number: 12187597
    Abstract: A MEMS microphone includes a substrate, a base, a capacitance system, and at least one cantilever structure. The substrate includes a back cavity, the base is disposed on one side of the substrate, and the capacitance system is disposed on the base. The capacitance system includes at least one back plate assembly, at least one first vibration diaphragm, and at least one second vibration diaphragm. The at least one first vibration diaphragm includes a first sub-vibration diaphragm, and the at least one second vibration diaphragm includes a second sub-vibration diaphragm. The sub-vibration diaphragm and the second sub-vibration diaphragm form a cantilever beam structure on the base, which increase compliance of the at least one first vibration diaphragm and the at least one second vibration diaphragm and reduce tension of the at least one first vibration diaphragm and the at least one second vibration diaphragm, thereby improving sensitivity of the microphones.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 7, 2025
    Assignee: AAC Kaitai Technologies (Wuhan) CO., LTD
    Inventors: Kaijie Wang, Zhuanzhuan Zhao
  • Publication number: 20240414478
    Abstract: Provided is a diaphragm and a micro-electromechanical system (MEMS) microphone. The diaphragm includes a vibrating portion and a support structure. The support structure includes a cantilever portion. Lengths of the first and second anchoring portion both extend along a circumferential direction of the vibrating portion, and a length extension direction of the first anchoring portion is opposite to that of the second one. The lengths of the first and second anchoring portions both extend along the circumferential direction of the vibrating portion, and the length extension direction of the first anchoring portion is opposite to that of the second one, so that the first and second anchoring portions and the cantilever portion are connected in a T shape. A vibration displacement range of the diaphragm is larger, thereby improving sensitivity and compliance of the MEMS microphone.
    Type: Application
    Filed: March 13, 2024
    Publication date: December 12, 2024
    Inventors: Minh Ngoc Nguyen, Linlin Wang, Rui Zhang, Kaijie Wang, Zhengyu Shi, Zhuanzhuan Zhao
  • Patent number: 12126959
    Abstract: The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: October 22, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Linlin Wang, Zhuanzhuan Zhao, Kaijie Wang, Zhengyu Shi, Minh Ngoc Nguyen, Rui Zhang
  • Publication number: 20240217809
    Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.
    Type: Application
    Filed: August 22, 2023
    Publication date: July 4, 2024
    Inventors: Zhuanzhuan Zhao, Kaijie Wang, Rui Zhang
  • Publication number: 20240155296
    Abstract: A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 9, 2024
    Inventors: Zhuanzhuan Zhao, Linlin Wang, Kaijie Wang, Rui Zhang
  • Patent number: 11974095
    Abstract: A MEMS microphone includes a substrate, a connecting base, and a capacitance system. Connecting ports are formed on the connecting base, where the at least two connecting ports are recessed outwards from an inner wall of the connecting base and are disposed at intervals. The capacitance system includes a system main body and connecting pins. A system main body of the capacitance system is fixed to the connecting ports of the connecting base through the connecting pins. In addition, the slit is formed between the outer side of the system main body and the inner wall of the connecting base, the capacitance system is stably and reliably assembled in the connecting base through a connecting structure where the connecting pins are matched with the connecting ports, and compliance of vibration of the system main body of the capacitance system is increased through matching the connecting pins with slit.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 30, 2024
    Assignee: AAC Kaital Technologies (Wuhan) CO., LTD
    Inventor: Kaijie Wang
  • Publication number: 20240080632
    Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.
    Type: Application
    Filed: December 29, 2022
    Publication date: March 7, 2024
    Inventors: Linlin Wang, Rui Zhang, Kaijie Wang, Zhuanzhuan Zhao, Minh Ngoc Nguyen
  • Publication number: 20240073626
    Abstract: A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.
    Type: Application
    Filed: November 30, 2022
    Publication date: February 29, 2024
    Inventors: Kaijie Wang, Zhuanzhuan Zhao
  • Publication number: 20240073610
    Abstract: A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.
    Type: Application
    Filed: November 30, 2022
    Publication date: February 29, 2024
    Inventors: Kaijie Wang, Zhuanzhuan Zhao, Linlin Wang
  • Publication number: 20240073625
    Abstract: A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.
    Type: Application
    Filed: November 30, 2022
    Publication date: February 29, 2024
    Inventors: Kaijie Wang, Zhuanzhuan Zhao
  • Patent number: 11838737
    Abstract: The present invention provides a vibration motor including a housing with an accommodation space, a vibration member and a fixed member accommodated in the accommodation space, and an elastic support member suspending the vibration member. The elastic support member has an elastic arm, a first fixed part, and a second fixed part. Both the first fixed part and the second fixed part are bent toward the same side of the elastic arm, and the vibration member is located between the first fixed part and the second fixed part. The elastic stress of the elastic support member is effectively improved and the service life of the elastic support member is improved.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: December 5, 2023
    Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
    Inventors: Kaijie Wang, Linlin Wang, Zhuanzhuan Zhao
  • Publication number: 20230379635
    Abstract: Provided is a MEMS microphone, including a base which forms a back cavity, and a capacitor system arranged on the base and connected to the base. The capacitor system includes a diaphragm located above the base and a backplate spaced from the diaphragm; and the MEMS microphone further includes a barrier structure, and the barrier structure is spaced from the capacitor system in a vibration direction. The barrier structure spaced from the capacitor system in the vibration direction can ensure that the movement of the diaphragm and the backplate is not affected under low sound pressure, so as not to affect the performance of the microphone, and can hinder the deformation of the diaphragm and the backplate under large sound pressure, thereby inhibiting failure of the microphone caused by fracture due to large deformation of the diaphragm and the backplate.
    Type: Application
    Filed: August 3, 2022
    Publication date: November 23, 2023
    Inventors: Zhuanzhuan Zhao, Kaijie Wang, Rui Zhang
  • Publication number: 20230353950
    Abstract: The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.
    Type: Application
    Filed: October 21, 2022
    Publication date: November 2, 2023
    Inventors: Linlin Wang, Zhuanzhuan Zhao, Kaijie Wang, Zhengyu Shi, Minh Ngoc Nguyen, Rui Zhang