Patents by Inventor Kaikun Yang

Kaikun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9017808
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: April 28, 2015
    Assignee: The Research Foundation for The State University of New York
    Inventors: Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Patent number: 8129001
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: March 6, 2012
    Assignee: The Research Foundation of State University of New York
    Inventors: Hao Howard Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Publication number: 20090269604
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Application
    Filed: March 12, 2009
    Publication date: October 29, 2009
    Applicant: The Research Foundation of State University of New York
    Inventors: Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Publication number: 20090232991
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 17, 2009
    Applicant: The Research Foundation of State University of New York
    Inventors: Hao Howard Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang