Patents by Inventor Kailei Zhang

Kailei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING
    Publication number: 20230411169
    Abstract: A method includes the step of thinning a semiconductor wafer by a horizontal stealth lasing process, and semiconductor wafers, dies and devices formed thereby. After formation of an integrated circuit layer on a semiconductor wafer, the wafer may be thinned by supporting an active surface of the wafer on a rotating chuck, and focusing a horizontally-oriented laser in multiple cycles at different radii within the rotating wafer. Upon completion of the multiple cycles, a portion of the wafer substrate may be removed, leaving the wafer thinned to its final thickness. Thereafter, a vertical stealth lasing process may be performed to cut individual semicondcutor dies from the thinned wafer.
    Type: Application
    Filed: June 15, 2022
    Publication date: December 21, 2023
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yi Wu, Junrong Yan, Zhonghua Qian, Keming Zhou, Kailei Zhang
  • Semiconductor device with top die positioned to reduce die cracking
    Patent number: 11177241
    Abstract: A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: November 16, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventors: Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin, Kim Lee Bock
  • SEMICONDUCTOR DEVICE WITH TOP DIE POSITIONED TO REDUCE DIE CRACKING
    Publication number: 20200381401
    Abstract: A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.
    Type: Application
    Filed: March 10, 2020
    Publication date: December 3, 2020
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin, Kim Lee Bock