Abstract: An electronic device is provided in the present disclosure, and the electronic device includes a middle frame, a heat transfer unit, a shielding case, a heat source and a radiator. The middle frame includes a first surface. The heat transfer unit is disposed on the first surface. The shielding case is spaced apart from the heat transfer unit and is provided with a shielding cavity. The heat source is disposed between the heat transfer unit and the shielding case and includes a circuit board disposed on the heat transfer unit and a first heat source component disposed on the circuit board, the first heat source component is disposed in the shielding cavity. The radiator is configured to dissipate heat from the shielding case and/or the heat source.

Abstract: An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.

Abstract: An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.

Abstract: An electronic device is provided in the present disclosure, and the electronic device includes a middle frame, a soaking unit, a shielding case, a heat source and a radiator. The middle frame includes a first surface. The soaking unit is disposed on the first surface. The shielding case is spaced apart from the soaking unit and is provided with a shielding cavity. The heat source is disposed between the soaking unit and the shielding case and includes a circuit board disposed on the soaking unit and a first heat source component disposed on the circuit board, the first heat source component is disposed in the shielding cavity. The radiator is configured to dissipate heat from the shielding case and/or the heat source.