Abstract: A chip removal head, a chip removal system and a chip removal method are provided. The chip removal head has a heating portion and an attractive force guide portion, the heating portion including a bottom surface and a top surface, which are opposite to each other, and the bottom surface is a surface in contact with a to-be-removed chip; the heating portion is connected to an external power supply, and generates a dissociation heat under the action of the external power supply, so as to release a connection between the to-be-removed chip and an external substrate; and the attractive force guide portion is configured to guide the to-be-removed chip, for which the connection has been released, to be adsorbed on the bottom surface of the heating portion.

Abstract: The application discloses a die bonding method of an LED chip and a display device. The method may include: a welding material is fixed on a metal pad of the LED chip, the LED chip fixed with the welding material is transferred onto a transient substrate, the metal pad of the LED chip on the transient substrate is aligned with a bonding pad on a receiving substrate, the welding material fixed on the LED chip is heated, and then the LED chip is fixed on the receiving substrate.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fourth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fourth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an linage side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a shore system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fourth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fourth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. The first lens element has a positive refractive power and a convex object-side surface. The second lens element has a negative refractive power and an image-side surface with a concave peripheral portion. The third lens element has an object-side surface with a concave peripheral portion. The fourth lens element has an image-side surface with a concave portion in a vicinity of an optical axis. The fifth lens element has an image-side surface with a concave portion in the vicinity of the optical axis and a convex peripheral portion.

Abstract: An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. The first lens element has a positive refractive power and a convex object-side surface. The second lens element has a negative refractive power and an image-side surface with a concave peripheral portion. The third lens element has an object-side surface with a concave peripheral portion. The fourth lens element has an image-side surface with a concave portion in a vicinity of an optical axis. The fifth lens element has an image-side surface with a concave portion in the vicinity of the optical axis and a convex peripheral portion.

Abstract: A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area.

Abstract: An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.

Abstract: An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.

Abstract: An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.