Abstract: A projector control system and a control method corresponding to same. The system includes a main controller, a dynamic current adjusting module, a color wheel controller, a color wheel rotation speed feedback module, and a light source; the dynamic current adjusting module includes a DLP module, a light source controller, and a power supply module; the color wheel rotation speed feedback module generates a feedback signal; the DLP module receives the feedback signal, and the DLP module receives dynamic brightness information and sends processed dynamic brightness information and a control signal to the light source controller according to the feedback signal; the light source controller controls the power module according to the received processed dynamic brightness information and the control signal sent by the DLP module to turn on a power switch and output a corresponding current value.

Abstract: A projector control system and a control method corresponding to same. The system includes a main controller, a dynamic current adjusting module, a color wheel controller, a color wheel rotation speed feedback module, and a light source; the dynamic current adjusting module includes a DLP module, a light source controller, and a power supply module; the color wheel rotation speed feedback module generates a feedback signal; the DLP module receives the feedback signal, and the DLP module receives dynamic brightness information and sends processed dynamic brightness information and a control signal to the light source controller according to the feedback signal; the light source controller controls the power module according to the received processed dynamic brightness information and the control signal sent by the DLP module to turn on a power switch and output a corresponding current value.

Abstract: A package structure is disclosed, the package structure includes a substrate, a chip, a bonding layer, and a coating. A plurality of grooves are disposed on the substrate. Silver bonding materials are disposed in the grooves and on a surface of the substrate, to form the bonding layer. The chip is connected to the substrate by using the bonding layer. The grooves are symmetrically arranged along a first and a second axis that are perpendicular to each other, a vertical projection of the chip on the substrate is centrosymmetric about the first and the second axis, and the vertical projection of the chip on the substrate covers a partial area of an outer-ring groove which faces a periphery of the chip. The coating covers a surface that is of the bonding layer and not in contact with the substrate or the chip, used to prevent migration of silver ions.