Patents by Inventor Kaisei Satou

Kaisei Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device comprising signal terminals extending from encapsulant
    Patent number: 10763240
    Abstract: A semiconductor device may include a first semiconductor chip, a second semiconductor chip, an encapsulant encapsulating the first and second semiconductor chips, a first signal terminal extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant, and a second signal terminal extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant. The first and second signal terminals may protrude from the encapsulant in a same direction. The first signal terminal may include, inside the encapsulant, a section where the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip. The second signal terminal may include, inside the encapsulant, a section where the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: September 1, 2020
    Assignee: DENSO CORPORATION
    Inventors: Shingo Iwasaki, Kaisei Satou, Yuri Imai
  • SEMICONDUCTOR DEVICE
    Publication number: 20190279961
    Abstract: A semiconductor device may include a first semiconductor chip, a second semiconductor chip, an encapsulant encapsulating the first and second semiconductor chips, a first signal terminal extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant, and a second signal terminal extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant. The first and second signal terminals may protrude from the encapsulant in a same direction. The first signal terminal may include, inside the encapsulant, a section where the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip. The second signal terminal may include, inside the encapsulant, a section where the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip.
    Type: Application
    Filed: February 6, 2019
    Publication date: September 12, 2019
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Shingo IWASAKI, Kaisei Satou, Yuri Imai