Patents by Inventor KAIST (Korea Advanced Institute of Science and Technology)

KAIST (Korea Advanced Institute of Science and Technology) has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140065362
    Abstract: The present invention relates to a method of tunning wettability of titanium dioxide layers against water by nanostructuring the titanium dioxide layers to increase a hydrophilicity of the titanium dioxide layers, and also coating the nanostructured titanium dioxide layers with silane layers to increase a hydrophobicity of the titanium dioxide layers. The method of tunning wettability of titanium dioxide layers against water according to the present invention comprises: (a) step of forming titanium dioxide layer on a substrate; (b) step of forming silica particle layers on the upper part of the titanium dioxide layer; (c) step of etching a surface of the laminate prepared in step (b); and (d) step of removing the silica particle layer etched and remained in the step (c).
    Type: Application
    Filed: December 14, 2012
    Publication date: March 6, 2014
    Applicant: KAIST (Korea Advanced Institute of Science and Technology)
    Inventor: KAIST (Korea Advanced Institute of Science and Technology)
  • Publication number: 20130221067
    Abstract: Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 29, 2013
    Applicants: KAIST (Korea Advanced Institute of Science and Technology), LG INNOTEK CO., LTD.
    Inventors: LG INNOTEK CO., LTD., KAIST (Korea Advanced Institute of Science and Technology)
  • Publication number: 20130162251
    Abstract: A parallel imaging (PI) method has been frequently used as a method for shortening an image acquisition time in the MRI field. The PI technique is a method for acquiring data using multi-channel coils, that is, several coils, when acquiring the data in MRI. According to this technique, data, the amount of which is smaller than that when the data is obtained using only one coil, is acquired, and then an image is obtained using coil information. According to an embodiment, a new image reconstruction method is proposed which adopts an expectation maximization (EM) technique that is different from the existing GRAPPA or SENSE technique when an image is obtained using PI data acquired through the radial trajectory.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 27, 2013
    Applicant: KAIST (Korea Advanced Institute of Science and Technology)
    Inventor: KAIST (Korea Advanced Institute of Science and Technology)