Abstract: Provided is a pressure sensitive adhesive sheet including a resin layer that is a multilayer structure containing at least a layer (X?), a layer (Y1), and a layer (X?) laminated in this order, a surface (?) of the layer (X?) of the resin layer having pressure sensitive adhesiveness, at least a constitutional component contained in the layer (Y1) being different from constitutional components contained in the layer (X?) and the layer (X?), on the prescribed cross section (P1) of the pressure sensitive adhesive sheet, in a range of 250 ?m in a horizontal direction freely-selected, a difference between a maximum value and a minimum value of the layer (X?) being 3.00 ?m or more, and a difference between a maximum value and a minimum value of the layer (Y1) being 5.00 ?m or more.

Abstract: Provided is a pressure sensitive adhesive sheet including a resin layer that is a multilayer structure containing at least a layer (X?), a layer (Y1), and a layer (X?) laminated in this order, a surface (?) of the layer (X?) of the resin layer having pressure sensitive adhesiveness, at least a constitutional component contained in the layer (Y1) being different from constitutional components contained in the layer (X?) and the layer (X?), on the prescribed cross section (P1) of the pressure sensitive adhesive sheet, in a range of 250 ?m in a horizontal direction freely-selected, a difference between a maximum value and a minimum value of the layer (X?) being 3.00 ?m or more, and a difference between a maximum value and a minimum value of the layer (Y1) being 5.00 ?m or more.

Abstract: An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.

Abstract: An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.

Abstract: Film-like orally administered medications are provided which are less likely to be attached to the oral mucous membrane upon intake and can be easily detached therefrom even if attached thereto. A film-like orally administered medication (1) includes at least a medical-agent-containing layer (11). Convex portions are formed on at least one surface of the orally administered medication (1). The convex portions have at least one type of shape selected from among tapers, columns, hemispheres, and frustums. The medical-agent-containing layer includes a medical agent and a base substance.