Patents by Inventor Kaitlyn M. Fisher

Kaitlyn M. Fisher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
    Patent number: 11948855
    Abstract: An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: April 2, 2024
    Assignee: Rockwell Collins, Inc.
    Inventors: Bret W. Simon, Jacob R. Mauermann, Mark T. Dimke, Kaitlyn M. Fisher