Patents by Inventor Kaixuan JIANG

Kaixuan JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11777260
    Abstract: The present invention discloses a charging socket lead frame assembly and a charging socket. The charging socket lead frame assembly has a lead frame which has a frame body and an electrical connection structure arranged in the frame body. The lead frame is adapted to be installed in a cavity of a charging socket, and a plurality of terminals of the charging socket are adapted to pass through the frame body. One end of the electrical connection structure is exposed from the frame body to electrically connect with a lead of a temperature sensor. The lead frame is arranged in non-electrical contact with at least one signal terminal of the charging socket. Therefore, the structure of the lead frame can be simplified and the manufacturing difficulty and cost can be reduced.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: October 3, 2023
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd., Tyco Electronics Technology (SIP) Ltd.
    Inventors: Fangyue Zhu, Jinshun Wang, Renyi Dou, Kaixuan Jiang
  • Publication number: 20230295463
    Abstract: A method of manufacturing an electrical connector and an electrical connector with a layer or primer with a free radical initiator dissolved therein which is applied to the connector housing. An oil-bleeding liquid silicone is applied to the layer or primer. The layer or primer crosslinks with the oil-bleeding liquid silicone to adhere the oil-bleeding liquid silicone. The method includes applying a layer or primer with a free radical initiator dissolved therein to the housing; applying an oil-bleeding liquid silicone to the primer; and crosslinking the oil-bleeding liquid silicone to the layer or primer to adhere the oil-bleeding silicone.
    Type: Application
    Filed: January 18, 2023
    Publication date: September 21, 2023
    Inventors: Dejie Tao, Lei Wang, Yiliang Wu, Ting Gao, Zenggang Wu, Kaixuan Jiang
  • Publication number: 20220385001
    Abstract: The present invention discloses a charging socket lead frame assembly and a charging socket. The charging socket lead frame assembly has a lead frame which has a frame body and an electrical connection structure arranged in the frame body. The lead frame is adapted to be installed in a cavity of a charging socket, and a plurality of terminals of the charging socket are adapted to pass through the frame body. One end of the electrical connection structure is exposed from the frame body to electrically connect with a lead of a temperature sensor. The lead frame is arranged in non-electrical contact with at least one signal terminal of the charging socket. Therefore, the structure of the lead frame can be simplified and the manufacturing difficulty and cost can be reduced.
    Type: Application
    Filed: May 20, 2022
    Publication date: December 1, 2022
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd., Tyco Electronics Technology (SIP) Ltd.
    Inventors: Fangyue ZHU, Jinshun WANG, Renyi DOU, Kaixuan JIANG
  • Patent number: 11442094
    Abstract: This application provides a polygonal spherical sampling device, belonging to the technical field of spherical field antenna measurement, and including a probe, a mounting rack and a supporting platform. The supporting platform is mounted on the mounting rack for placing an object to be tested. The number of the probes is more than or equal to six, the probes are mounted on the mounting rack and a plurality of the probes are distributed on at least two vertical planes in a three-dimensional spherical space and are arranged around the supporting platform. The vertical planes are arranged symmetrically about a vertical axis, the probes are uniformly distributed at intervals of A degrees on each vertical plane, the probes on a same horizontal plane are uniformly distributed at intervals of B degrees, both A and B are less than or equal to 90.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: September 13, 2022
    Assignee: Shenzhen Xinyi Technology Co., Ltd.
    Inventors: Linbin Chen, Zhenkun Xie, Daoyi Wang, Cien Sun, Kaixuan Jiang
  • Publication number: 20220187355
    Abstract: This application provides a polygonal spherical sampling device, belonging to the technical field of spherical field antenna measurement, and including a probe, a mounting rack and a supporting platform. The supporting platform is mounted on the mounting rack for placing an object to be tested. The number of the probes is more than or equal to six, the probes are mounted on the mounting rack and a plurality of the probes are distributed on at least two vertical planes in a three-dimensional spherical space and are arranged around the supporting platform. The vertical planes are arranged symmetrically about a vertical axis, the probes are uniformly distributed at intervals of A degrees on each vertical plane, the probes on a same horizontal plane are uniformly distributed at intervals of B degrees, both A and B are less than or equal to 90.
    Type: Application
    Filed: June 1, 2021
    Publication date: June 16, 2022
    Applicant: Shenzhen Xinyi Technology Co., Ltd.
    Inventors: Linbin CHEN, Zhenkun XIE, Daoyi WANG, Cien SUN, Kaixuan JIANG
  • Patent number: 11276961
    Abstract: The application relates to a connector housing, a connector housing assembly and a connector assembly. The connector housing has a housing body and a shroud. The housing body encloses an accommodating cavity. The shroud is disposed around and connected to the housing body. A gap is formed between the shroud and the housing body to form a slot. The connector housing is further provided with one of a lug or a sliding groove. The lug or the sliding groove is positioned in the slot. According to the connector housing assembly and the connector assembly in the application, the lugs are matched with the sliding grooves to guide the first connector housing and the second connector housing during plug-in connection, so as to avoid failure of installation in place due to relative deflection of them.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: March 15, 2022
    Assignees: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Yongsong Di, Kaixuan Jiang, Haomai Yin
  • Publication number: 20200381863
    Abstract: The application relates to a connector housing, a connector housing assembly and a connector assembly. The connector housing has a housing body and a shroud. The housing body encloses an accommodating cavity. The shroud is disposed around and connected to the housing body. A gap is formed between the shroud and the housing body to form a slot. The connector housing is further provided with one of a lug or a sliding groove. The lug or the sliding groove is positioned in the slot. According to the connector housing assembly and the connector assembly in the application, the lugs are matched with the sliding grooves to guide the first connector housing and the second connector housing during plug-in connection, so as to avoid failure of installation in place due to relative deflection of them.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 3, 2020
    Inventors: Yongsong DI, Kaixuan JIANG, Haomai YIN