Abstract: A method for monitoring and analyzing large tunnel machines based on automatic collection of big data includes the following steps: dividing a tunnel operation area, obtaining environmental information of a tunnel operation sub-area, analyzing rock drilling difficulty of the tunnel operation sub-area, confirming a tunnel operation trajectory, analyzing conformity of the tunnel operation sub-area, processing an abnormal tunnel operation sub-area, and analyzing health state of a tunnel rock drill. According to the present disclosure, a rock drilling difficulty coefficient of each tunnel operation sub-area is used to analyze a corresponding steel rotating speed, and then the tunnel operation trajectory is confirmed. After the tunnel operation is completed, the operation conformity of each tunnel operation sub-area is analyzed, and each abnormal tunnel operation sub-area is screened out and processed accordingly.

Abstract: Some examples of the present disclosure provide a method for manufacturing a wire layer. The method for manufacturing a wire layer includes steps in which a wafer having an opening is provided; conductive grains are deposited on the wafer, and on a bottom and a side wall of the opening to form a conductive film, during which a temperature of a surface of the wafer is lower than a flowing temperature of the conductive film, and when the temperature of the surface of the wafer is greater than or equal to the flowing temperature, the conductive film starting to flow; and after the conductive film is formed, the temperature of the surface of the wafer is elevated to perform a reflowing process, such that the conductive film is converted to a conductive layer filling up the opening.

Abstract: Some examples of the present disclosure provide a method for manufacturing a wire layer. The method for manufacturing a wire layer includes steps in which a wafer having an opening is provided; conductive grains are deposited on the wafer, and on a bottom and a side wall of the opening to form a conductive film, during which a temperature of a surface of the wafer is lower than a flowing temperature of the conductive film, and when the temperature of the surface of the wafer is greater than or equal to the flowing temperature, the conductive film starting to flow; and after the conductive film is formed, the temperature of the surface of the wafer is elevated to perform a reflowing process, such that the conductive film is converted to a conductive layer filling up the opening.

Abstract: A communication device based on a USB interface and a method for implementing service configuration are provided. The method is used for the communication device based on the USB interface, comprising: said communication device based on the USB interface reporting a device descriptor to a host, thus making said host complete loading of a host driver; said communication device based on the USB interface receiving a control instruction sent from the host side through the USB interface; and said communication device based on the USB interface configuring service attribute information according to said control instruction, so as to enable said service attribute information to indicate service attributes of said communication device based on the USB interface. The USB control information controls the service attribute information such that said device can implement support to service differentiation aiming at different operating systems.