Abstract: The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.

Abstract: In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.

Abstract: The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.

Abstract: In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.

Abstract: An apparatus for recognizing an object may include a lens, a camera and a signal-processing unit. The lens may include two cross sections having different focal lengths. The camera may be configured to photograph the object having a first part through the lens. The first part may have a first shape. The signal-processing unit may be configured to recognize a height of the first part based on deviations of the first shape in an image obtained from the camera. Thus, the apparatus may only include the cylindrical lens interposed between the object and the camera except for the softwares for processing the signals. As a result, the apparatus may have a simple structure without a structure of a laser irradiation.