Patents by Inventor Kakeru WADA

Kakeru WADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of etching silicon-containing film, computer-readable storage medium, and apparatus for etching silicon-containing film
    Patent number: 11189498
    Abstract: There is provided a method of etching a silicon-containing film formed on a substrate, the method including: etching the silicon-containing film by using both a first fluorine-containing gas and a second fluorine-containing gas, the first fluorine-containing gas including at least an F2 gas and the second fluorine-containing gas including at least a ClF3 gas, an IF7 gas, an IF5 gas or an SF6 gas.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: November 30, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takehiko Orii, Yasuo Asada, Jun Lin, Ayano Hagiwara, Shinji Irie, Kenji Tanouchi, Kakeru Wada
  • METHOD OF ETCHING SILICON-CONTAINING FILM, COMPUTER-READABLE STORAGE MEDIUM, AND APPARATUS FOR ETCHING SILICON-CONTAINING FILM
    Publication number: 20190355589
    Abstract: There is provided a method of etching a silicon-containing film formed on a substrate, the method including: etching the silicon-containing film by using both a first fluorine-containing gas and a second fluorine-containing gas, the first fluorine-containing gas including at least an F2 gas and the second fluorine-containing gas including at least a ClF3 gas, an IF7 gas, an IF5 gas or an SF6 gas.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 21, 2019
    Inventors: Takehiko ORII, Yasuo ASADA, Jun LIN, Ayano HAGIWARA, Shinji IRIE, Kenji TANOUCHI, Kakeru WADA