Patents by Inventor Kal Liu

Kal Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Top exposed package and assembly method
    Patent number: 8586414
    Abstract: A semiconductor package and it manufacturing method includes a lead frame having a die pad, and a source lead with substantially a V groove disposed on a top surface. A semiconductor chip disposed on the die pad. A metal plate connected to a top surface electrode of the chip having a bent extension terminated in the V groove in contact with at least one of the V groove sidewalls.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: November 19, 2013
    Assignee: Alpha & Omega Semiconductor, Inc.
    Inventors: Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kal Liu
  • Top exposed Package and Assembly Method
    Publication number: 20120146202
    Abstract: A semiconductor package and it manufacturing method includes a lead frame having a die pad, and a source lead with substantially a V groove disposed on a top surface. A semiconductor chip disposed on the die pad. A metal plate connected to a top surface electrode of the chip having a bent extension terminated in the V groove in contact with at least one of the V groove sidewalls.
    Type: Application
    Filed: December 14, 2010
    Publication date: June 14, 2012
    Inventors: Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kal Liu