Patents by Inventor Kaleb A. Wilson

Kaleb A. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive label for circuit
    Patent number: 11997782
    Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 28, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Kaleb A. Wilson, Shams U Arifeen, Bradley Russell Bitz, João Elmiro Da Rocha Chaves, Mark A. Tverdy
  • A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY
    Publication number: 20240117855
    Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Kaleb A. Wilson, Bradley R. Bitz, Mark A. Tverdy, Quang Nguyen, Christopher Glancey, Jagadeesh B. Ginjupalli, Pridhvi Dandu
  • HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
    Publication number: 20240071863
    Abstract: A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Charles E. Siko, Kaleb A. Wilson, Bradley R. Bitz
  • CONNECTOR FOR COUPLING A CAPACITOR TO A PRINTED CIRCUIT BOARD ASSEMBLY
    Publication number: 20230216225
    Abstract: Apparatuses, systems, and methods for coupling a capacitor to a printed circuit board assembly. One example apparatus can include a number of capacitors and a connector coupled to the number of capacitors, the connector configured to removably couple the number of capacitors to a printed circuit board assembly of a solid state drive.
    Type: Application
    Filed: February 22, 2022
    Publication date: July 6, 2023
    Inventors: Bradley R. Bitz, Joao E. Chaves, Kaleb A. Wilson, Mark Tverdy
  • THERMALLY CONDUCTIVE LABEL FOR CIRCUIT
    Publication number: 20230065633
    Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Kaleb A. Wilson, Shams U. Arifeen, Bradley Russell Bitz, João Elmiro da Rocha Chaves, Mark A. Tverdy