Patents by Inventor Kaleb A. Wilson

Kaleb A. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250234452
    Abstract: Methods and apparatuses related to printed circuit board assemblies having one or more thermally conductive posts used to improve cooling capacity are disclosed. The thermally conductive posts may be thermally coupled to one or more components mounted on a printed circuit board. Moreover, the thermally conductive posts may be configured to disrupt a flow of coolant over the printed circuit board assemblies.
    Type: Application
    Filed: December 31, 2024
    Publication date: July 17, 2025
    Inventors: Mark A. Tverdy, Kaleb A. Wilson, Bradley R. Bitz, Amy R. Griffin
  • Publication number: 20250157885
    Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a multi-layer substrate populated with one or more integrated circuit devices that includes one or more core layers interspersed with one or more vertically-arranged conductive layers. A conductive layer of the vertically-arranged conductive layers includes a linear array of planar fins that extends into a cavity region along an edge of the multi-layer substrate. The linear array of planar fins is configured to receive, through the conductive layer, heat that is generated by the one or more integrated circuit devices, and transfer the heat for dissipation to an environment surrounding the semiconductor device assembly.
    Type: Application
    Filed: November 15, 2024
    Publication date: May 15, 2025
    Inventors: Kaleb A. WILSON, Amy R. GRIFFIN, Mark A. TVERDY, Bradley Russell BITZ
  • Publication number: 20240305026
    Abstract: Various embodiments described herein provide a connector assembly with integrated data and backup energy connections, which can be used to electrically couple together two or more printed circuit boards and electrically couple at least one of those printed circuit boards to a backup energy source. For example, a connector assembly of an embodiment can be used to implement a memory sub-system by coupling together two or more printed circuit boards of the memory sub-system and coupling the memory sub-system to a backup energy source, such as a set of capacitors or a set of batteries, which can be used to power the memory sub-system in the event of a main power loss.
    Type: Application
    Filed: March 5, 2024
    Publication date: September 12, 2024
    Inventors: Mark A. Tverdy, Kaleb A. Wilson
  • Patent number: 11997782
    Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 28, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Kaleb A. Wilson, Shams U Arifeen, Bradley Russell Bitz, João Elmiro Da Rocha Chaves, Mark A. Tverdy
  • Publication number: 20240117855
    Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Kaleb A. Wilson, Bradley R. Bitz, Mark A. Tverdy, Quang Nguyen, Christopher Glancey, Jagadeesh B. Ginjupalli, Pridhvi Dandu
  • Publication number: 20240071863
    Abstract: A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Charles E. Siko, Kaleb A. Wilson, Bradley R. Bitz
  • Publication number: 20230216225
    Abstract: Apparatuses, systems, and methods for coupling a capacitor to a printed circuit board assembly. One example apparatus can include a number of capacitors and a connector coupled to the number of capacitors, the connector configured to removably couple the number of capacitors to a printed circuit board assembly of a solid state drive.
    Type: Application
    Filed: February 22, 2022
    Publication date: July 6, 2023
    Inventors: Bradley R. Bitz, Joao E. Chaves, Kaleb A. Wilson, Mark Tverdy
  • Publication number: 20230065633
    Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Kaleb A. Wilson, Shams U. Arifeen, Bradley Russell Bitz, João Elmiro da Rocha Chaves, Mark A. Tverdy