Patents by Inventor Kallol Bera

Kallol Bera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250022694
    Abstract: A substrate support assembly includes a heater plate including a dielectric material, a heater electrode embedded within the heater plate, a set of distributed purge channels formed within the heater plate, wherein the set of distributed purge channels provides a set of gas flow paths to equalize a gas flow from within the heater plate and direct the gas flow in a direction below the heater plate, a ground electrode embedded within the heater plate, and a radio frequency (RF) mesh embedded within the plate.
    Type: Application
    Filed: July 3, 2024
    Publication date: January 16, 2025
    Inventors: Pranav Vijay Gadre, Adib M. Khan, Qiwei Liang, Dmitry Lubomirsky, Hyun Joo Lee, Paneendra Prakash Bhat, Douglas A. Buchberger, JR., Onkara Swamy Korasiddaramaiah, Vijay D. Parkhe, Junghoon Kim, Kallol Bera, Rupali Sahu, Sathya Swaroop Ganta
  • Patent number: 12142458
    Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: November 12, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
  • Publication number: 20240297059
    Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.
    Type: Application
    Filed: May 14, 2024
    Publication date: September 5, 2024
    Inventors: Andrew NGUYEN, Sathya Swaroop GANTA, Kallol BERA, Canfeng LAI
  • Publication number: 20240282554
    Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
    Type: Application
    Filed: May 1, 2024
    Publication date: August 22, 2024
    Inventors: Thai Cheng Chua, Christian Amormino, Hanh Nguyen, Kallol Bera, Philip Allan Kraus
  • Publication number: 20240271284
    Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.
    Type: Application
    Filed: April 12, 2024
    Publication date: August 15, 2024
    Inventors: Kallol BERA, Sathya Swaroop GANTA, Timothy Joseph FRANKLIN, Kaushik ALAYAVALLI, Akshay DHANAKSHIRUR, Stephen C. GARNER, Bhaskar KUMAR
  • Publication number: 20240249924
    Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body. The assemblies may include a second bipolar electrode embedded within the electrostatic chuck body. An entirety of the second bipolar electrode may be radially inward of at least a portion of the first bipolar electrode. The first bipolar electrode and the second bipolar electrode may be coaxial with one another. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one RF power supply. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one DC power supply.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Jian Li, Kallol Bera, Edward P. Hammond, Dmitry A. Dzilno, Juan Carlos Rocha-Alvarez, Xiaopu Li
  • Publication number: 20240219337
    Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.
    Type: Application
    Filed: March 13, 2024
    Publication date: July 4, 2024
    Inventors: XIAOPU LI, KALLOL BERA, YAOLING PAN, KELVIN CHAN, AMIR BAYATI, PHILIP ALLAN KRAUS, KENRIC T. CHOI, WILLIAM JOHN DURAND
  • Patent number: 12020965
    Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 25, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Andrew Nguyen, Sathya Swaroop Ganta, Kallol Bera, Canfeng Lai
  • Patent number: 12002654
    Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: June 4, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Thai Cheng Chua, Christian Amormino, Hanh Nguyen, Kallol Bera, Philip Allan Kraus
  • Patent number: 11984302
    Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: May 14, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Job George Konnoth Joseph, Sathya Swaroop Ganta, Kallol Bera, Andrew Nguyen, Jay D. Pinson, II, Akshay Dhanakshirur, Kaushik Comandoor Alayavalli, Canfeng Lai, Ren-Guan Duan, Jennifer Y. Sun, Anil Kumar Kalal, Abhishek Pandey
  • Patent number: 11959868
    Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: April 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Xiaopu Li, Kallol Bera, Yaoling Pan, Kelvin Chan, Amir Bayati, Philip Allan Kraus, Kenric T. Choi, William John Durand
  • Patent number: 11959174
    Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kallol Bera, Sathya Swaroop Ganta, Timothy Joseph Franklin, Kaushik Alayavalli, Akshay Dhanakshirur, Stephen C. Garner, Bhaskar Kumar
  • Patent number: 11908662
    Abstract: Embodiments described herein relate to apparatus and techniques for radio frequency (RF) phase control in a process chamber. A process volume is defined in the process chamber by a faceplate electrode and a support pedestal. A grounding bowl is disposed within the process chamber about the support pedestal opposite the process volume. The grounding bowl substantially fills a volume other than the process volume below the support pedestal. A phase tuner circuit is coupled to an RF mesh disposed in the support pedestal and the faceplate electrode. The tuner circuit adjusts a phase difference between a phase of the faceplate electrode and a phase of the RF mesh.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: February 20, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Xiaopu Li, Kallol Bera, Edward P. Hammond, IV, Jonghoon Baek, Amit Kumar Bansal, Jun Ma, Satoru Kobayashi
  • Publication number: 20230377855
    Abstract: Embodiments of the present disclosure generally relate to a substrate processing chamber, and methods for cleaning the substrate processing chamber are provided herein. An electrode cleaning ring is disposed in a lower portion of a process volume (e.g., disposed below a substrate support in the process volume). The electrode cleaning ring is a capacitively coupled plasma source. The electrode cleaning ring propagates plasma into the lower portion of the process volume. RF power is provided to the electrode cleaning ring via an RF power feed-through. The RF plasma propagated by the electrode cleaning ring removes deposition residue in the lower portion of the process volume.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Mukesh Shivakumaraiah CHITRADURGA, Luke BONECUTTER, Sathya Swaroop GANTA, Canfeng LAI, Jay D. PINSON, Kaushik Comandoor ALAYAVALLI, Kallol BERA
  • Patent number: 11823871
    Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Jozef Kudela, Tsutomu Tanaka, Alexander V. Garachtchenko, Dmitry A. Dzilno, Avinash Shervegar, Kallol Bera, Xiaopu Li, Anantha K. Subramani, John C. Forster
  • Patent number: 11810810
    Abstract: Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described. A pie anchor can be positioned in the center of the susceptor base to hold the pie-shaped skins in place during processing.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: November 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kaushal Gangakhedkar, Kallol Bera, Joseph Yudovsky
  • Publication number: 20230116396
    Abstract: Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described. A pie anchor can be positioned in the center of the susceptor base to hold the pie-shaped skins in place during processing.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 13, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Kaushal Gangakhedkar, Kallol Bera, Joseph Yudovsky
  • Publication number: 20230107392
    Abstract: Methods of generating a plasma in a semiconductor processing chamber comprise: applying a radio frequency (RF) power to generate a plasma in a plasma region of the processing chamber, the processing chamber containing: a showerhead, an ion blocker plate, and a substrate, and the plasma region being defined by a front surface of the showerhead and a back surface of the ion blocker plate; and applying a bias the ion blocker plate so that there is no light-up in the processing chamber. Some methods further include dynamically tuning the bias by assessing conditions of light-up or no light-up and adjusting the bias. Some methods further include applying the bias zonally.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Applied Materials, Inc
    Inventors: Kallol Bera, Xiaopu Li, Tsutomu Tanaka
  • Patent number: 11581206
    Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: February 14, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Jennifer Sun, Philip Allan Kraus, Xiaopu Li, Kallol Bera, Michael D. Willwerth, Albert Barrett Hicks, III, Lisa J. Enman, Mark Joseph Saly, Daniel Thomas McCormick
  • Patent number: 11557501
    Abstract: Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described. A pie anchor can be positioned in the center of the susceptor base to hold the pie-shaped skins in place during processing.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: January 17, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kaushal Gangakhedkar, Kallol Bera, Joseph Yudovsky