Abstract: High mobility thin film transistors for fabricating integrated drivers for active matrix displays and a special method of fabrication for obtaining the thin film transistors having mobility sufficiently high enough as drivers operable in the several megahertz frequency range needed for driving high resolution active matrix displays.

Abstract: A method for fabricating single crystal islands on a high temperature substrate, thereby allowing for the use of high temperature processes to further make devices incorporating the islands such as, for example, high mobility thin film transistor integrated drivers for active matrix displays.

Abstract: A liquid crystal display is described that includes gray scale capability. Each pixel of the display is subdivided into a plurality of subpixels. Each subpixel has coupled thereto a thin film transistor, the thin film transistor coupled to the effective subpixel capacitor. The liquid crystal material is contained between the effective capacitor plates. The voltage applied to the effective capacitor resulting from current flowing through the thin film transistor controls the optical activity of the subpixel. By controlling parameters associated with the thin transistor and by controlling the voltage applied to the pixel (and the subpixel thin film transistors), the optical properties of the subpixel can be controlled as a result of the charge applied across the effective capacitor to provide an angular independent gray scale for the pixel.

Abstract: A structure and method of fabricating a active matrix display with halftone grayscale and wide viewing angle, having an active matrix array and a control capacitor array fabricated on separate substrates.

Abstract: A structure and method of fabricating a active matrix display with halftone grayscale and wide viewing angle, having an active matrix array and a control capacitor array fabricated on separate substrates.

Abstract: A half-tone pixel having subpixels and control capacitor constituting a 100 percent optically active pixel. The subpixel design results in no reductions in the maximum pixel aperture ratio, brightness or contrast, as a pixel with no subpixels would have. Various subpixel layouts including differing numbers of subpixels and subpixel-turn-on sequences may be implemented and still result in the entire pixel being optically active.

Abstract: High mobility thin film transistors for fabricating integrated drivers for active matrix displays and a special method of fabrication for obtaining the thin film transistors having mobility sufficiently high enough as drivers operable in the several megahertz frequency range needed for driving high resolution active matrix displays.

Abstract: An improved process is disclosed for the deposition in a reactor vessel of silicon on the interior walls of the reactor vessel and for the subsequent separation of the silicon from those walls. The reactor vessel has a generally rectangular cross section and is formed of a refractory material from which the deposited silicon separates by thermal expansion shear separation during cool down of the vessel and the deposited silicon. To improve the output of the deposition system, a plurality of partitions are provided in the reactor vessel and integral with the reactor walls. These partitions act as additional deposition surfaces, increasing the number of silicon sheets deposited as well as increasing the efficiency of the chemical reaction.

Abstract: A process is disclosed for removing carbonaceous material from a surface in a high pressure oxygen plasma. A surface, such as a surface of a silicon ribbon, having a layer of carbonaceous material thereon is positioned in a high pressure plasma reaction volume. A high pressure rf plasma is generated in which the plasma includes reactive and ionic oxygen species. The reactive oxygen species are directed to and react with the layer of carbonaceous material to oxidize that material. The reaction products of the oxidation step include carbon dioxide and, possibly a non-oxidizing ash material which can easily be removed from the silicon surface.

Abstract: An improved process is disclosed for the high pressure plasma hydrogenation of silicon tetrachloride. Hydrogen and silicon tetrachloride are reacted in the presence of a high pressure plasma and further in the presence of a boron catalyst to form trichlorosilane and dichlorosilane. By adding the boron catalyst the overall conversion efficiency is increased and the dichlorosilane content in the reaction effluent is increased.

Abstract: A method is provided for semiconductor ribbon-to-ribbon conversion in a rigid edge mode. A combination carrier and mask is provided by which the ribbon is secured during the conversion process. The carrier holds the ribbon and simultaneously masks the edges of the ribbon from the heating effects of an impinging energy beam. The energy beam, such as a laser or electron beam, impinges on the ribbon and creates a molten zone which extends through the thickness of the ribbon. During the growth process, the molten zone is caused to move along the length of the ribbon. The mask prevents melting of the extreme edge portions of the ribbon and thus allows a rapid growth rate and a stable molten zone without sophisticated electronic equipment to gate the energy beam at the ribbon edges.

Abstract: A step-wise process is disclosed for the efficient deposition of silicon. The process begins by reacting trichlorosilane and hydrogen on a heated substrate to deposit silicon. Silicon deposition efficiency of this reaction is determined by measuring the silicon to chlorine ratio in the deposition reaction effluent. The silicon-bearing effluent from the deposition reaction includes trichlorosilane, dichlorosilane, and silicon tetrachloride. The silicon-bearing effluent is collected in a first accumulator. The deposition reaction is continued using the collected quantity of silicon-bearing effluent together with an additional quantity of trichlorosilane as an input to the continuing reaction. The additional quantity of trichlorosilane is determined to make up the amount of silicon deposited in the previous step.

Abstract: Apparatus is provided for semiconductor ribbon-to-ribbon conversion in a rigid edge mode. A combination carrier and mask is provided by which the ribbon is secured during the conversion process. The carrier holds the ribbon and simultaneously masks the edges of the ribbon from the heating effects of an impinging energy beam. The energy beam, such as a laser or electron beam, impinges on the ribbon and creates a molten zone which extends through the thickness of the ribbon. During the growth process, the molten zone is caused to move along the length of the ribbon. The mask prevents melting of the extreme edge portions of the ribbon and thus allows a rapid growth rate and a stable molten zone without sophisticated electronic equipment to gate the energy beam at the ribbon edges.

Abstract: A method is provided for predepositing dopant material on semiconductor substrates. The semiconductor substrates are positioned within a high pressure plasma reactor apparatus. A high pressure rf plasma is generated in the apparatus at a pressure of about one atmosphere or greater. Dopant materials such as B.sub.2 H.sub.6, PH.sub.3, or AsH.sub.3 are introduced to the plasma and form ionized species of the dopant. The plasma and the ionized species are directed to the surface of the semiconductor substrates whereon a uniform layer of the dopant is deposited.

Abstract: Method and apparatus for minimizing the deleterious effects of structural imperfections in polycrystalline silicon solar cells uses a high pressure plasma system. The high pressure plasma system is used to introduce atomic hydrogen into the polycrystalline silicon substrates or into polycrystalline silicon solar cells. The silicon can be subjected to the hydrogenation either before or after it has a junction. The high pressure plasma system includes a high pressure chamber having a first and a second auxiliary chamber coupled to the high pressure chamber.

Abstract: Polycrystalline silicon is produced by a high pressure plasma process. A silicon halide or halosilane is reacted with hydrogen in the presence of a high pressure plasma to deposit silicon on a heated substrate. The effluent from this reaction is collected, the silicon-bearing compounds separated out, and re-introduced to the deposition reaction. The initial silicon bearing compound can be inexpensive silicon tetrachloride. Maximum utilization of all silicon bearing reaction products maximizes polycrystalline silicon production efficiency.

Abstract: A method is disclosed for the plasma hydrogenation of silicon tetrachloride. A high pressure plasma is utilized to effect a reaction of hydrogen and silicon tetrachloride to form trichlorosilane and other hydrogenated silicon chlorides.

Abstract: Polycrystalline silicon is deposited on the interior surface of a shaped container. The silicon is deposited by reacting hydrogen and a silicon bearing gas in the presence of a high pressure plasma. The silicon body is separated from the shaped container by utilizing thermal expansion shear stress.