Abstract: A miniature power supply and voltage regulator containing a ceramic substrate with conductive metal bonded to the top and bottom of the substrate. The power supply contains a first device for converting alternating current to direct current, a device means for converting alternating current to direct current, a device for determining the current demands of a load, and a device for delivering the current demands to the load. The said power supply and voltage regulator has a power handling capability of at least 23 watts per square inch of surface area.

Abstract: A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps integrally connected to the copper layer extend therefrom; the copper in the copper layer and the copper bumps is substantially identical. The heterogeneous juncture band has a copper-wetted surface area that is at least about twice the apparent surface area of the copper overlying the first juncture band and consisting essentially of alumina grains unitary with the copper layer and being constituted by finger-like copper protuberances unitary with the copper layer and occupying the space between the alumina grains.

Abstract: A process for preparing an insulated metallized substrate, wherein a specified metallized substrate is heated from ambient temperature to a peak temperature of at least about 800 degrees centigrade while contacting the substrate with an inert atmosphere containing less than 10 parts per million of oxygen, maintained at such peak temperature for a specified period of time while being contacted with said inert gas, and thereafter heated at a peak temperature of at least about 800 degrees centigrade while being contacted with a gas containing at least 100 parts per million of oxygen.

Abstract: A miniature power supply and voltage regulator containing a ceramic substrate with conductive metal bonded to the top and bottom of the substrate. The power supply contains a first device for converting alternating current to direct current, a device for converting alternating current to direct current, a device for determining the current demands of a load, and a device for delivering the current demands to the load. The power supply and voltage regulator has a power handling capability of at least 23 watts per square inch of surface area.

Abstract: A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and a layer of electrically conductive material. A process for making the metallized ceramic substrate is also disclosed. The process includes an acid etchant step that increases the actual surface area of the treated surface of the ceramic workpiece without undermining the integrity of the ceramic surface while at the same time selectively attacking vitreous binder phase present between substrate grains and creating even deeper penetration at the relatively higher energy triple point junctures. In this manner, metal anchor sites that enhance adhesion are provided. During subsequent high temperature firing these anchors hold the resulting composite together as a chemical bond is formed in addition to a mechanical bond or interlock.

Abstract: A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and a layer of electrically conductive material. The metallized ceramic substrate is made by a process which includes an acid etchant step that increases the actual surface area of the treated surface of the ceramic workpiece without undermining the integrity of the ceramic surface while at the same time selectively attacking vitreous binder phase present between substrate grains and creating even deeper penetration at the relatively higher energy triple joint junctures. In this manner, metal anchor sites that enhance adhesion are provided. During subsequent high temperature firing these anchors hold the resulting composite together as a chemical bond is formed in addition to a mechanical bond or interlock.