Abstract: Systems and methods for creating unique device identification for semiconductor devices are described. In some embodiments, a method may include receiving a wafer identification mark printed on a semiconductor wafer having a plurality of dies fabricated thereon; receiving a leadframe identification mark printed on a leadframe configured to receive the plurality of dies during a die attach operation; and for each of the plurality of dies: (a) recording a wafer location of a given die prior to the die attach operation; (b) recording a leadframe location of the given die after the die attach operation; (c) creating a device identification mark for the given die based upon the wafer identification mark, the leadframe identification mark, the wafer location, and the leadframe location; and (d) printing the device identification mark on a package of the given die.

Abstract: A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a next successive vertically stacked chip is described. The device is fabricated by patterning islands of aluminum atop the passivation layer of each supporting chip simultaneously with processing to form bond pad caps. The fabrication process requires no additional cost, and has the advantage of providing standoffs for a plurality of chips by processing in wafer form, thereby avoiding additional assembly costs. Further, the standoffs provide improved thermal dissipation for the device and a uniform, stable bonding surface for wire bonding each of the chips to the substrate.

Abstract: A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a next successive vertically stacked chip is described. The device is fabricated by patterning islands of aluminum atop the passivation layer of each supporting chip simultaneously with processing to form bond pad caps. The fabrication process requires no additional cost, and has the advantage of providing standoffs for a plurality of chips by processing in wafer form, thereby avoiding additional assembly costs. Further, the standoffs provide improved thermal dissipation for the device and a uniform, stable bonding surface for wire bonding each of the chips to the substrate.