Abstract: A lead frame assembly includes a first lead frame panel having a die receiving area for receiving a semiconductor die, the die having an upper surface having one or more die bond pads located thereon. A second lead frame panel includes integral leads, each integral lead including a terminal, a connecting element extending from the terminal, and a shaped contact located at an end of the connecting element. The second lead frame panel is adapted to be stacked on the first lead frame panel to position each terminal laterally of a respective die receiving area. The positioning of the terminals locates each shaped contact for contact with a respective die bond pad to establish an electrical connection between the die bond pad and the respective terminal when the semiconductor die is mounted on the respective die receiving area.

Abstract: A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal (34) on it and a second, opposing side of the die includes bonding pads (14). The bonding pads are electrically connected to the solder on the foil sheet with wires (16). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (20). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit (10).

Abstract: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.