Patents by Inventor Kam Fung Yip

Kam Fung Yip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10205371
    Abstract: A voice coil motor includes a housing having a cavity; a movable assembly received in the cavity; a fixing assembly configured outside of the movable assembly; and a first spring plate and a second spring plate configured at an upper surface and a lower surface of the movable assembly respectively. The fixing assembly comprises at least two magnetic elements connected with the first spring plate and a spacer member configured on the second spring plate to connect the second spring plate to the magnetic elements or the housing. The voice coil motor is served as an actuator of electronic products such as digital cameras, mobile phones, and digital cameras, which has thin thickness, good performance and strong applicability.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: February 12, 2019
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Sidney Chou, Yiu Sing Ho, Kam Fung Yip, Wen Ju Yang, Hai Yang Wu, Shou Sheng Gao, Yong Bing Hu, Guo Hong Lu
  • Patent number: 9841609
    Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 12, 2017
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Sidney Shen Kuang Chou, Yiu Sing Ho, Kam Fung Yip, Jian Feng He
  • Publication number: 20170351112
    Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
    Type: Application
    Filed: June 28, 2016
    Publication date: December 7, 2017
    Inventors: Sidney Shen Kuang CHOU, Yiu Sing HO, Kam Fung YIP, Jian Feng HE
  • Publication number: 20160308430
    Abstract: A voice coil motor includes a housing having a cavity; a movable assembly received in the cavity; a fixing assembly configured outside of the movable assembly; and a first spring plate and a second spring plate configured at an upper surface and a lower surface of the movable assembly respectively. The fixing assembly comprises at least two magnetic elements connected with the first spring plate and a spacer member configured on the second spring plate to connect the second spring plate to the magnetic elements or the housing. The voice coil motor is served as an actuator of electronic products such as digital cameras, mobile phones, and digital cameras, which has thin thickness, good performance and strong applicability.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 20, 2016
    Inventors: Sidney CHOU, Yiu Sing HO, Kam Fung YIP, Wen Ju YANG, Hai Yang WU, Shou Sheng GAO, Yong Bing HU, Guo Hong LU
  • Patent number: 7600310
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: October 13, 2009
    Assignee: SAE Magnetics (H.K.) Lts.
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery L. Wang, Can Hua Chen
  • Patent number: 7522384
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: April 21, 2009
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery L. Wang, Can Hua Chen
  • Publication number: 20060232890
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Application
    Filed: June 16, 2006
    Publication date: October 19, 2006
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery Wang, Can Hua Chen
  • Publication number: 20050013055
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Application
    Filed: January 7, 2004
    Publication date: January 20, 2005
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery Wang, Can Hua Chen