Patents by Inventor Kam Lee

Kam Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7768420
    Abstract: A wireless network that may include one or more access points, one or more wireless controllers and one or more appliances. The one or more access points include, or may be coupled with, a server location agent that operates to determine or estimate the locations of the one or more wireless controllers. Upon determining the location of the one or more wireless controllers, the server location agent may determine a proximity of one or more appliances to the wireless controllers and may cause the wireless controllers to display a customized user interface that may be configured based on proximity to one or more appliances as well as policies and/or historical data. In addition, the appliances in the user's proximity may be automatically switched on and controlled to serve the user.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: August 3, 2010
    Assignee: Intel Corporation
    Inventors: Raja Neogi, Kam Lee
  • Publication number: 20060162212
    Abstract: There is provided an air conditioner. In the air conditioner, a front panel is installed to a front of a main body, a front cover is disposed at a front of the front panel and detachably coupled to the main body, and an art panel is interchangeably inserted in the front cover.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 27, 2006
    Inventors: Ji Kim, Joong Yoo, Ki Yoo, Hee Kwon, Kam Lee, In Park
  • Publication number: 20060092037
    Abstract: Methods and apparatuses for operation and control of network appliances using detected signal strength to determine location of a wireless controller.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Raja Neogi, Kam Lee
  • Publication number: 20050274803
    Abstract: A communication device comprising a portable casing having space adapted to receive at least one digital and communication integrated circuit (IC) or smart card therein; the casing also containing a contact smart card connector that is adapted to electrically couple to the smart card. A contact smart card reader electronic module is provided within the casing and connecting the smart card connector to an external port, the external port adapted for electrically coupling to an external host for data exchange between the smart card and the external host. This device also contains an antenna assembly adapted to electrically couple to the IC or smart card for wireless data transmission between this device and an external contactless smart card reader.
    Type: Application
    Filed: June 8, 2005
    Publication date: December 15, 2005
    Inventor: Kam Lee
  • Publication number: 20050262529
    Abstract: A method, apparatus and system for remote real-time access of personal multimedia content is disclosed. One embodiment of the present invention enables users to securely access their personal multimedia content from remote locations while retaining the ability to manipulate the content (hereafter referred to as “trick play”). Numerous components of a system, including a service agent, a licensing agent and a distribution agent, may manage various aspects of this functionality. In one embodiment, a service agent may generate index table metadata that enables the distribution agent to respond to trick play requests from the user.
    Type: Application
    Filed: May 20, 2004
    Publication date: November 24, 2005
    Inventors: Raja Neogi, Kam Lee
  • Publication number: 20050214980
    Abstract: A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal (34) on it and a second, opposing side of the die includes bonding pads (14). The bonding pads are electrically connected to the solder on the foil sheet with wires (16). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (20). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit (10).
    Type: Application
    Filed: March 24, 2004
    Publication date: September 29, 2005
    Inventors: Hei Shiu, Kam Lee, Ho Wong
  • Publication number: 20050156301
    Abstract: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
    Type: Application
    Filed: March 16, 2005
    Publication date: July 21, 2005
    Inventors: Hei Shiu, Wai Chow, Kam Lee
  • Publication number: 20050146001
    Abstract: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
    Type: Application
    Filed: January 6, 2004
    Publication date: July 7, 2005
    Inventors: Hei Shiu, Wai Chow, Kam Lee