Abstract: An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.

Abstract: A method of making optical diffuser elements (20) includes providing a substrate (100) composed of a polymer material and having openings (102) therein. An optical diffuser material (110) is dispensed into the openings (102), and the optical diffuser material (110) is hardened to form a sheet (200) composed of regions of the optical diffuser material (110) surrounded laterally by the polymer material. The method includes separating the sheet (200) into multiple optical diffuser elements (30) that retain their mechanical stability and optical properties when subjected to a reflow process.

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

Abstract: A method of wafer-level manufacturing of an optical package (285) is disclosed. The method comprises forming an apertured substrate (170; 405) by a process of vacuum injection molding, each aperture (175A; 175B) in the apertured substrate configured to support an optical element (225; 420; 425). The method also comprises coupling the apertured substrate to a further substrate (255) comprising optical devices (260, 265) aligned with the apertures in the apertured substrate. Also disclosed is optical package (285, 600) formed according to the method and an apparatus, such as a smartphone, comprising the optical package.

Abstract: A method of producing optical modules comprising transferring liquid polymer to a lens mold array by dipping an array of fingers of a transfer device into a liquid polymer, bringing the array of fingers into proximity with recesses of the lens mold array so that the liquid polymer is received in the recesses, then separating the array of fingers and the lens mold array so that liquid polymer is retained in the recesses, and forming lenses on optical devices by bringing the lens mold array into proximity with the array of optical devices so that the liquid polymer contacts a surface of the optical devices, and curing the liquid polymer to form the lenses on the optical devices.

Abstract: A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces.

Abstract: A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier.

Abstract: A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.

Abstract: A method of making optical diffuser elements (20) includes providing a substrate (100) composed of a polymer material and having openings (102) therein. An optical diffuser material (110) is dispensed into the openings (102), and the optical diffuser material (110) is hardened to form a sheet (200) composed of regions of the optical diffuser material (110) surrounded laterally by the polymer material. The method includes separating the sheet (200) into multiple optical diffuser elements (30) that retain their mechanical stability and optical properties when subjected to a reflow process.

Abstract: An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

Abstract: An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.

Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.

Abstract: This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.

Abstract: This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.