Patents by Inventor Kamalesh K. Srivistava

Kamalesh K. Srivistava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Creation of lead-free solder joint with intermetallics
    Patent number: 8268716
    Abstract: A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: September 18, 2012
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Valerie Oberson, Srinivasa N. Reddy, Krystyna W. Semkow, Richard A. Shelleman, Kamalesh K. Srivistava