Patents by Inventor Kambiz Munshi

Kambiz Munshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package resistance measurement
    Patent number: 7327150
    Abstract: For one embodiment, an integrated circuit includes a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit. The integrated circuit also includes a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: February 5, 2008
    Assignee: Intel Corporation
    Inventors: Arvind Kumar, Kambiz Munshi
  • Integrated circuit package resistance measurement
    Publication number: 20070080696
    Abstract: For one embodiment, an integrated circuit includes a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit. The integrated circuit also includes a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.
    Type: Application
    Filed: October 11, 2005
    Publication date: April 12, 2007
    Inventors: Arvind Kumar, Kambiz Munshi