Abstract: Certain aspects of the present disclosure provide a filter. The filter generally includes a series resonator coupled between a first port of the filter and a second port of the filter, and a shunt resonator coupled between a node of the filter and a reference potential node of the filter, the node being coupled between the first port and the second port. The shunt resonator typically includes a first piezoelectric substrate, a first plurality of reflectors disposed above the first piezoelectric substrate, and a first plurality of interdigital transducers (IDTs) disposed above the first piezoelectric substrate and between the first plurality of reflectors, wherein the shunt resonator is configured as a dual mode structure (DMS).

Abstract: Certain aspects of the present disclosure provide a filter. The filter generally includes a series resonator coupled between a first port of the filter and a second port of the filter, and a shunt resonator coupled between a node of the filter and a reference potential node of the filter, the node being coupled between the first port and the second port. The shunt resonator typically includes a first piezoelectric substrate, a first plurality of reflectors disposed above the first piezoelectric substrate, and a first plurality of interdigital transducers (IDTs) disposed above the first piezoelectric substrate and between the first plurality of reflectors, wherein the shunt resonator is configured as a dual mode structure (DMS).

Abstract: This invention focuses on minimizing the hot spots on a filter chip by creating thermal radiators using the mechano-acoustic structures and connection circuitry. A gradual increase of metal to wafer relation is made to provide better heat dissipation and heat sinking. Preferably the shunt lines of the ladder type arrangement of SAW resonators (RS1, RS2, RS3) comprise a broadened section (BBCN).

Abstract: A miniaturized SAW duplexer includes SAW filters carried on a monolithic piezoelectric chip that is mounted inside a multi-layered ceramic package. A phase matching stripline is embedded diagonally and between two ground layers of the multi-layered ceramic package and is positioned between a wall of vias for significantly minimizing coupling between transmitted and received filters by providing an improved ground shielding of the phase matching stripline. Coupling within the same filter and coupling between the SAW filters are suppressed and thus provide enhanced isolation performance. for the SAW duplexer.