Patents by Inventor Kamyar Pashayi

Kamyar Pashayi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites
    Patent number: 9512291
    Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: December 6, 2016
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, RENSSELAER POLYTECHNIC INSTITUTE
    Inventors: Theodorian Borca-Tasciuc, Sushumna Iruvanti, Fengyuan Lai, Kamyar Pashayi, Joel Plawsky, Hafez Raeisi-Fard
  • HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOSTRUCTURED METALLIC NETWORK-POLYMER COMPOSITES
    Publication number: 20150247019
    Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
    Type: Application
    Filed: May 14, 2015
    Publication date: September 3, 2015
    Applicant: Rensselaer Polytechnic Institute
    Inventors: Theodorian Borca-Tasciuc, Sushumna Iruvanti, Fengyuan Lai, Kamyar Pashayi, Joel Plawsky, Hafez Raeisi-Fard
  • High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites
    Patent number: 9045674
    Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: June 2, 2015
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, Theodorian Borca-Tasciuc, Hafez Raeisi-Fard, Fengyuan Lai, Kamyar Pashayi, Joel Plawsky
  • HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOSTRUCTURED METALLIC NETWORK-POLYMER COMPOSITES
    Publication number: 20120187332
    Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
    Type: Application
    Filed: January 24, 2012
    Publication date: July 26, 2012
    Applicants: RENSSELAER POLYTECHNIC INSTITUTE, INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sushumna Iruvanti, Theodorian Borca-Tasciuc, Hafez Raeisi-Fard, Fengyuan Lai, Kamyar Pashayi, Joel Plawsky