Patents by Inventor Kan Cheng

Kan Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10678990
    Abstract: In some embodiments, an initial circuit arrangement is provided. The initial circuit arrangement includes cells that include default-rule lines and non-default-rule lines. Line widths of the default-rule lines are selectively increased for a first cell in the initial circuit arrangement, thereby providing a first modified circuit arrangement. A first maximum capacitance value is calculated for the first cell of the first modified circuit arrangement. A second modified circuit arrangement is provided by selectively increasing line widths of the non-default-rule lines in the first modified circuit arrangement. A second maximum capacitance value is calculated for the first cell of the second modified circuit arrangement. A line width of a first non-default-rule line is selectively reduced based on whether the first maximum capacitance value adheres to a predetermined relationship with the second maximum capacitance value. The second modified circuit arrangement is manufactured on a semiconductor substrate.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 9, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuo-Nan Yang, Chung-Hsing Wang, Yi-Kan Cheng, Kumar Lalgudi
  • Publication number: 20200175220
    Abstract: A method of a layout diagram (of a conductive line structure for an IC) including: for a first set of pillar patterns included in an initial layout diagram that represents portions of an M(i) layer of metallization and where i is a non-negative number, the first set including first and second pillar patterns which are non-overlapping of each other, which have long axes that are substantially collinear with a reference line, and which have a first distance of separation, determining a first distance of separation as between corresponding immediately adjacent members of the first set; recognizing that the first distance is less than a transverse routing (TVR) separation threshold for an M(i+j) layer of metallization, where j is an integer and j?2; and increasing the first distance so as to become a second distance which is greater than the TVR separation threshold of the M(i+j) layer.
    Type: Application
    Filed: November 27, 2019
    Publication date: June 4, 2020
    Inventors: Hiranmay BISWAS, Chung-Hsing WANG, Kuo-Nan YANG, Yi-Kan CHENG
  • Publication number: 20200168527
    Abstract: A device, such as a computer system, includes an interconnection device die and at least two additional device dice. The additional device dies can be system on integrated chip (SOIC) dies laying face to face (F2F) on the interconnection device die. The interconnection device die includes electrical connectors on one surface, enabling connection to and/or among the additional device dice. The interconnection device die includes at least one redistribution circuit structure, which may be an integrated fan out (InFO) structure, and at least one through-silicon via (TSV). The TSV enables connection between a signal line, power line or ground line, from an opposite surface of the interconnection device die to the redistribution circuit structure and/or electrical connectors. At least one of the additional dice can be a three-dimensional integrated circuit (3DIC) die with face to back (F2B) stacking.
    Type: Application
    Filed: September 6, 2019
    Publication date: May 28, 2020
    Applicant: Taiwan Semiconductor Manfacturing Co., Ltd.
    Inventors: Fong-Yuan CHANG, Chin-Chou LIU, Chin-Her CHIEN, Cheny-hung YEH, Hui Yu LEE, Po-Hsiang HUANG, Yi-Kan CHENG
  • Publication number: 20200151382
    Abstract: A method of making a semiconductor device includes determining a temperature profile for a first die of a three-dimensional integrated circuit (3DIC), wherein the first die comprises a plurality of sub-regions of the first die based on the determined temperature profile. The method further includes simulating operation of a circuit in a second die of the 3DIC based on the determined temperature profile and a corresponding sub-region of the plurality of sub-regions.
    Type: Application
    Filed: January 16, 2020
    Publication date: May 14, 2020
    Inventors: Chi-Wen CHANG, Hui Yu LEE, Ya Yun LIU, Jui-Feng KUAN, Yi-Kan CHENG
  • Publication number: 20200135388
    Abstract: An entangled inductor structure generates opposite polarity internal magnetic fields therein to substantially reduce, or cancel, external magnetic fields propagating outside of the entangled inductor structure. These reduced external magnetic fields propagating outside of the entangled inductor structure effectively reduce a keep out zone (KOZ) between the entangled inductor structure and other electrical, mechanical, and/or electro-mechanical components. This allows the entangled inductor structure to be situated closer to these other electrical, mechanical, and/or electro-mechanical components within the IC as compared to conventional inductors which generate larger external magnetic fields.
    Type: Application
    Filed: June 28, 2019
    Publication date: April 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ka Fai CHANG, Chin-Chou LIU, Fong-Yuan CHANG, Hui Yu LEE, Yi-Kan CHENG
  • Publication number: 20200134125
    Abstract: A method of generating a layout diagram including a first level of metallization (M_1st level) including: identifying, in the layout diagram, a filler cell and a first functional cell substantially abutting the filler cell; the first functional cell including first and second side boundaries, first wiring patterns in the M_1st level, and representing corresponding first conductors in the first functional cell region; and first and second groups of cut patterns overlying corresponding portions of the first wiring patterns and being substantially aligned with the corresponding first and second side boundaries; adjusting one or more locations of corresponding one or more selected cut patterns of the second group thereby correspondingly elongating one or more selected ones of the first wiring patterns so as to be corresponding first elongated wiring patterns which extend across the second boundary of the first functional cell into the filler cell.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 30, 2020
    Inventors: Po-Hsiang HUANG, Chin-Chou LIU, Sheng-Hsiung CHEN, Fong-Yuan CHANG, Hui-Zhong ZHUANG, Meng-Hsueh WANG, Yi-Kan CHENG, Chun-Chen CHEN
  • Publication number: 20200134124
    Abstract: A method (of generating a layout diagram) includes generating a cell, representing at least part of a circuit in a semiconductor device, which is arranged at least in part according to second tracks of the M_2nd level (M_2nd tracks), and first tracks of the M_1st level (M_1st tracks). The generating the cell includes: selecting, based on a chosen site for the cell in the layout diagram, one of the M_2nd tracks; generating a first M_2nd pin pattern representing an output pin of the circuit; arranging a long axis of the first pin pattern substantially along the selected M_2nd track; generating second, third, fourth and fifth M_1st pin patterns representing corresponding input pins of the circuit; and arranging long axes of the second to fifth pin patterns substantially along corresponding ones of the M_1st tracks.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 30, 2020
    Inventors: Pin-Dai SUE, Chin-Chou LIU, Sheng-Hsiung CHEN, Fong-Yuan CHANG, Lee-Chung LU, Yen-Hung LIN, Li-Chun TIEN, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU
  • Publication number: 20200118189
    Abstract: Embodiments of this specification disclose systems and methods for automotive part recognition based on a vehicle damage assessment image. A method includes: obtaining a damage assessment image of a target vehicle; obtaining an automotive part list of the target vehicle based on a vehicle identification code of the target vehicle, wherein the automotive part list comprises customized configuration information of automotive parts of the target vehicle; and determining a damaged automotive part of the target vehicle from the damage assessment image based on the customized configuration information of the automotive parts of the target vehicle and an image recognition algorithm, to obtain an automotive part identification serial number of the determined damaged automotive part.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Inventors: Zixiao WANG, Guanru LI, Jian WANG, Kan ZHANG, Fan ZHOU, Taiwei ZHANG, Taifei FAN, Danni CHENG
  • Publication number: 20200118365
    Abstract: Embodiments of this specification disclose a method and an apparatus for automotive part recognition based on a vehicle damage assessment image. The method includes: determining a damaged automotive part of a vehicle by recognizing a damage assessment image of the vehicle based on an image recognition algorithm; obtaining an automotive part list of the vehicle, wherein the automotive part list comprises a plurality of automotive parts corresponding to a plurality of automotive part identification serial numbers; matching the damaged automotive part with the plurality of automotive parts in the automotive part list to determine an automotive part corresponding to the damaged automotive part; and outputting an automotive part identification serial number of the determined automotive part.
    Type: Application
    Filed: December 14, 2019
    Publication date: April 16, 2020
    Inventors: Zixiao WANG, Guanru LI, Jian WANG, Kan ZHANG, Fan ZHOU, Taiwei ZHANG, Taifei FAN, Danni CHENG
  • Patent number: 10578400
    Abstract: A sight includes a main body, an objective unit, an eyepiece unit, an inner lens barrel, an adjusting ring and an indicating structure. The main body has a first end portion and a second end portion. The objective unit is connected to the first end portion. The eyepiece unit is connected to the second end portion. The inner lens barrel is disposed in the main body, wherein the objective unit, the inner lens barrel and the eyepiece unit are sequentially arranged to form an optical axis. The adjusting ring is rotatably disposed on the main body. The indicating structure is disposed on the adjusting ring and includes an illuminating element and an optical transmitting element. When the sight is connected to an electronic device, the illuminating element emits a light beam, and the light beam passes through the optical transmitting element for generating an indicating sign.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: March 3, 2020
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Sung-Po Cheng, Chin-Teng Lin, Chia-Kan Chang, Shang-Yung Liang
  • Publication number: 20200058075
    Abstract: Embodiments of the specification provide a method, apparatus, server and terminal device for obtaining a vehicle loss assessment image. The method may include: receiving video data of a damaged vehicle and information of a damaged portion of the damaged vehicle; extracting one or more video images from the video data; classifying the one or more video images into one or more candidate image classification sets of the damaged portion based on the information of the damaged portion; and selecting a vehicle loss assessment image from the one or more candidate image classification sets according to a screening condition.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Inventors: Haitao ZHANG, Jinlong HOU, Xin GUO, Yuan CHENG, Jian WANG, Juan XU, Fan ZHOU, Kan ZHANG
  • Publication number: 20200050867
    Abstract: Embodiments of the application provide a method, apparatus, server, and terminal device for obtaining a vehicle loss assessment image. A computer-implemented method for obtaining a vehicle loss assessment image comprises: receiving video data of a damaged vehicle; detecting one or more video images in the video data to identify a damaged portion in the one or more video images; classifying the one or more video images into one or more candidate image classification sets of the damaged portion based on the identified damaged portion; and selecting a vehicle loss assessment image from the one or more candidate image classification sets according to a screening condition.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Haitao ZHANG, Jinlong HOU, Xin GUO, Yuan CHENG, Jian WANG, Juan XU, Fan ZHOU, Kan ZHANG
  • Publication number: 20200051863
    Abstract: A method for forming an integrated circuit (IC) is provided. The method includes the following operations. A circuit layout including a first load region and a second load region is received. A full power network of the circuit layout is obtained. The full power network is transformed into a first power network according to the first load region. A first power simulation is performed upon the first power network. The full power network is transformed into a second power network according to the second load region. A second power simulation is performed upon the second power network. The IC is fabricated according to the circuit layout.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 13, 2020
    Inventors: KA FAI CHANG, FONG-YUAN CHANG, CHIN-CHOU LIU, YI-KAN CHENG
  • Patent number: 10540475
    Abstract: A system including a memory; and a simulation tool connected to the memory. The simulation tool is configured to receive information related to a plurality of dies. The simulation tool is further configured to receive a plurality of input vectors. The simulation tool is further configured to determining a temperature profile for a first die of the plurality of dies. The simulation tool is further configured to simulate operation of a second die of the plurality of dies based on the determined temperature profile and the received plurality of input vectors.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng
  • Publication number: 20200006325
    Abstract: A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.
    Type: Application
    Filed: September 12, 2019
    Publication date: January 2, 2020
    Inventors: Hui Yu Lee, Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng
  • Patent number: 10515178
    Abstract: A method (of generating a layout diagram of a conductive line structure includes: determining that a first set of first to fourth short pillar patterns (which represent portions of an M(i) layer of metallization and are located relative to a grid), violates a minimum transverse-routing (TVR) distance of alpha-direction-separation, wherein (1) the grid has orthogonal alpha and beta tracks, and (2) the short pillar patterns have long axes which are substantially co-track aligned with a first one of the alpha tracks and have a first distance (of alpha-direction-separation between immediately adjacent members of the first set) which is less than the TVR distance; and merging pairings of the first & second and third & fourth short pillar patterns into corresponding first and second medium pillar patterns which have a second distance of alpha-direction-separation therebetween; the second value being greater than the TVR distance.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hiranmay Biswas, Chung-Hsing Wang, Kuo-Nan Yang, Yi-Kan Cheng
  • Patent number: 10495415
    Abstract: A sight includes an inner lens barrel, a compensating device and a converting unit. The inner lens barrel includes a plurality of lenses constituting an optical axis. The compensating device includes a base, an adjusting unit and an adjusting cap. The adjusting unit is disposed on the base, is penetrated through the base and is placed against the inner lens barrel. The adjusting cap is connected to the adjusting unit, wherein the adjusting cap is rotated for axially moving the adjusting unit, and the inner lens barrel is pushed by the adjusting unit so that the optical axis is shifted. The converting unit is configured to convert shift amount of the optical axis to an electric signal corresponding to number of rotation of the adjusting cap and output the electric signal.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 3, 2019
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Hung-Chi Chou, Chia-Kan Chang, Sung-Po Cheng
  • Publication number: 20190301361
    Abstract: A FAIR engine system includes an air compressor subsystem where oxygen enriched air is compressed, stored and injected into the chambers of a FAIR engine to accelerate the chemical reaction and to reduce harmful mono-nitrogen oxides (NOx) emission
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Inventor: Kan Cheng
  • Publication number: 20190286784
    Abstract: A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in at least one of a non-circular group or a cyclic group which violates a design rule; and temporarily preventing, if there is a violation, placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 19, 2019
    Inventors: Fong-Yuan CHANG, Chin-Chou LIU, Hui-Zhong ZHUANG, Meng-Kai HSU, Pin-Dai SUE, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU, Jung-Chou TSAI
  • Publication number: 20190285382
    Abstract: A sight includes an inner lens barrel, a compensating device and a converting unit. The inner lens barrel includes a plurality of lenses constituting an optical axis. The compensating device includes a base, an adjusting unit and an adjusting cap. The adjusting unit is disposed on the base, is penetrated through the base and is placed against the inner lens barrel. The adjusting cap is connected to the adjusting unit, wherein the adjusting cap is rotated for axially moving the adjusting unit, and the inner lens barrel is pushed by the adjusting unit so that the optical axis is shifted. The converting unit is configured to convert shift amount of the optical axis to an electric signal corresponding to number of rotation of the adjusting cap and output the electric signal.
    Type: Application
    Filed: February 26, 2019
    Publication date: September 19, 2019
    Inventors: Hung-Chi Chou, Chia-Kan Chang, Sung-Po Cheng