Abstract: A method and apparatus comprising a wafer platform which rotates a semiconductor wafer at a predetermined speed while being moved in a linear motion with respect to a stationary water jet nozzle spraying a water or fluid jet onto the wafer during a wafer scrubbing process. The coupled rotary and linear motions of the wafer facilitates through washing or rinsing of the wafer surface and spreads impact energy of water or fluid sprayed onto a wafer surface over a large surface area on the wafer, resulting in a substantial reduction of particles remaining at the center of the wafer after the wafer scrubbing operation and preventing or minimizing the likelihood of impact damage to the wafer during the wafer scrubbing process. In another embodiment, the water or fluid jet nozzle moves along a horizontal axis while the spinning wafer remains stationary.