Patents by Inventor Kana UCHIMURA

Kana UCHIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
    Patent number: 11905412
    Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: February 20, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Takahiro Taki, Takako Ejiri, Tetsuro Iwakura, Kana Uchimura, Toshiki Fujii, Yukako Omori, Tetsuya Kato, Osamu Fujioka
  • RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
    Publication number: 20220169852
    Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 2, 2022
    Inventors: Takahiro TAKI, Takako EJIRI, Tetsuro IWAKURA, Kana UCHIMURA, Toshiki FUJII, Yukako OMORI, Tetsuya KATO, Osamu FUJIOKA