Patents by Inventor Kanae Horiuchi
Kanae Horiuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220361333Abstract: An electronic element mounting substrate includes a substrate including a first layer, a second layer located on a lower surface of the first layer, and a third layer located on a lower surface of the second layer, and on which an electronic element is to be mounted. The substrate has a via conductor that passes through the first layer to the third layer in a vertical direction. The substrate includes respective electrical conductor layers located between the respective layers and connected to the via conductor in a plan perspective. Each electrical conductor layer includes a land portion surrounding the via conductor, a clearance portion surrounding the land portion, and a peripheral portion surrounding the clearance portion and electrically insulated from the land portion with the clearance portion interposed between the land portion and the peripheral portion.Type: ApplicationFiled: May 28, 2020Publication date: November 10, 2022Applicant: KYOCERA CorporationInventor: Kanae HORIUCHI
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Patent number: 10580711Abstract: An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.Type: GrantFiled: May 17, 2017Date of Patent: March 3, 2020Assignee: Kyocera CorporationInventor: Kanae Horiuchi
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Publication number: 20190295910Abstract: An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.Type: ApplicationFiled: May 17, 2017Publication date: September 26, 2019Applicant: KYOCERA CorporationInventor: Kanae HORIUCHI
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Patent number: 10261282Abstract: An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.Type: GrantFiled: September 25, 2017Date of Patent: April 16, 2019Assignee: KYOCERA CORPORATIONInventors: Kenichi Kohama, Kanae Horiuchi
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Publication number: 20180376041Abstract: An image sensor mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an image sensor mount in a central area of its upper surface, in which an image sensor is mountable. The inorganic substrate includes a protrusion protruding upward in a peripheral area surrounding the image sensor mount. The wiring board is a frame arranged on the upper surface of the inorganic substrate to surround the image sensor mount and have a lower surface partially in contact with the protrusion. The wiring board includes a lens mount on its upper surface. The bond is located between the inorganic substrate and the wiring board.Type: ApplicationFiled: December 14, 2016Publication date: December 27, 2018Applicant: KYOCERA CorporationInventors: Kouji MIURA, Kanae HORIUCHI
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Publication number: 20180088296Abstract: An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.Type: ApplicationFiled: September 25, 2017Publication date: March 29, 2018Inventors: Kenichi KOHAMA, Kanae HORIUCHI
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Patent number: 9826641Abstract: There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.Type: GrantFiled: May 31, 2013Date of Patent: November 21, 2017Assignee: KYOCERA CorporationInventors: Akihiko Funahashi, Masatsugu Iiyama, Kanae Horiuchi, Yousuke Moriyama
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Patent number: 9609754Abstract: There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.Type: GrantFiled: January 22, 2014Date of Patent: March 28, 2017Assignee: KYOCERA CORPORATIONInventors: Akihiko Funahashi, Kanae Horiuchi, Yousuke Moriyama
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Patent number: 9609743Abstract: There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed.Type: GrantFiled: January 31, 2014Date of Patent: March 28, 2017Assignee: KYOCERA CORPORATIONInventors: Akihiko Funahashi, Kanae Horiuchi, Yousuke Moriyama
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Publication number: 20160007447Abstract: There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed.Type: ApplicationFiled: January 31, 2014Publication date: January 7, 2016Inventors: Akihiko FUNAHASHI, Kanae HORIUCHI, Yousuke MORIYAMA
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Publication number: 20150305160Abstract: There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.Type: ApplicationFiled: January 22, 2014Publication date: October 22, 2015Applicant: KYOCERA CorporationInventors: Akihiko FUNAHASHI, Kanae HORIUCHI, Yousuke MORIYAMA
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Publication number: 20150124422Abstract: There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.Type: ApplicationFiled: May 31, 2013Publication date: May 7, 2015Applicant: KYOCERA CorporationInventors: Akihiko Funahashi, Masatsugu Iiyama, Kanae Horiuchi, Yousuke Moriyama