Patents by Inventor Kanae Matsumura

Kanae Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150134271
    Abstract: A vibration waveform output by a gyro sensor set in a main pump is received. The vibration waveform is subjected to a frequency analysis and a frequency spectrum is calculated. A feature value is calculated from the frequency spectrum. Life expiration of the main pump is determined using the feature value. When the feature value is represented as R, a sum of squares of amplitudes in the frequency spectrum is represented as D, and a sum of squares of the amplitudes exceeding a first determination value is represented as P, R=?(P/D).
    Type: Application
    Filed: November 6, 2014
    Publication date: May 14, 2015
    Inventors: Masahisa IKEJIRI, Kanae MATSUMURA, Shuichi IGUCHI
  • Patent number: 7768029
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: August 3, 2010
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Publication number: 20080001163
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Application
    Filed: August 20, 2007
    Publication date: January 3, 2008
    Applicants: TOYODA GOSEI CO., LTD., KOHA CO., LTD.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 7285803
    Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: October 23, 2007
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Hideaki Kato, Kanae Matsumura, Shunsuke Ohtsuka
  • Patent number: 7279723
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: October 9, 2007
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 7071959
    Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: July 4, 2006
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Hideaki Kato, Koichi Kaga, Kanae Matsumura
  • Patent number: 6872585
    Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: March 29, 2005
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Yuji Takahashi, Hideaki Kato, Shunsuke Ohtsuka
  • Publication number: 20050030762
    Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
    Type: Application
    Filed: August 5, 2004
    Publication date: February 10, 2005
    Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Hideaki Kato, Kanae Matsumura, Shunsuke Ohtsuka
  • Publication number: 20040240203
    Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
    Type: Application
    Filed: March 19, 2004
    Publication date: December 2, 2004
    Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
  • Patent number: 6812481
    Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: November 2, 2004
    Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Yuji Takahashi, Hideaki Kato, Shunsuke Ohtsuka
  • Publication number: 20040206964
    Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.
    Type: Application
    Filed: May 11, 2004
    Publication date: October 21, 2004
    Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.
    Inventors: Kanae Matsumura, Yuji Takahashi, Hideaki Kato, Shunsuke Ohtsuka
  • Patent number: 6781648
    Abstract: A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller than the number of green LEDs.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: August 24, 2004
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yuji Takahashi, Kanae Matsumura, Hideaki Kato, Koichi Kaga
  • Publication number: 20040113869
    Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 17, 2004
    Applicant: Toyoda Gosei Co., Ltd.
    Inventors: Hideaki Kato, Koichi Kaga, Kanae Matsumura
  • Patent number: 6730942
    Abstract: A sealing member for a short-wavelength light emitting element comprises a main agent and a curing agent. The main agent comprises a first component of an alicyclic epoxy produced by hydrogenating an aromatic epoxy, preferably a bisphenol A epoxy, and a second component of an alicyclic epoxy having a lower molecular weight than the first component. The mixing amount of the second component is not less than 10% by weight and less than 30% by weight based on the main agent.
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: May 4, 2004
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Akira Mabuchi, Masato Kawamura, Kanae Matsumura, Takemasa Yasukawa
  • Publication number: 20030168652
    Abstract: A sealing member for a short-wavelength light emitting element comprises a main agent and a curing agent. The main agent comprises a first component of an alicyclic epoxy produced by hydrogenating an aromatic epoxy, preferably a bisphenol A epoxy, and a second component of an alicyclic epoxy having a lower molecular weight than the first component. The mixing amount of the second component is not less than 10% by weight and less than 30% by weight based on the main agent.
    Type: Application
    Filed: January 23, 2003
    Publication date: September 11, 2003
    Applicant: Toyoda Gosei Co., Ltd.
    Inventors: Akira Mabuchi, Masato Kawamura, Kanae Matsumura, Takemasa Yasukawa
  • Patent number: 6617787
    Abstract: An alicyclic epoxy resin is used as a material for forming a member for sealing a Group III nitride compound semiconductor light-emitting device.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: September 9, 2003
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Hisaki Kato, Kanae Matsumura, Akira Mabuchi, Naoki Yoshimura, Kazuhiro Sakai
  • Publication number: 20030042844
    Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 6, 2003
    Inventors: Kanae Matsumura, Yuji Takahashi, Hideaki Kato, Shunsuke Ohtsuka
  • Publication number: 20020080301
    Abstract: A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller than the number of green LEDs.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 27, 2002
    Inventors: Yuji Takahashi, Kanae Matsumura, Hideaki Kato, Koichi Kaga
  • Patent number: 5843264
    Abstract: The present invention is directed to a vibration insulating assembly including a rubber vibration insulator and metallic members bonded thereto. In particular, the present invention relates to a method for manufacturing the same, by which the quality of the resulting assembly is improved by providing a high bonding strength between the vibration insulator and metallic members. Retainers are provided about the peripheries of the bonding surfaces of the rubber vibration insulator in order to restrict displacement and deformation of the rubber vibration insulator across the bonding surfaces or at the bonding interface with the metallic members and to facilitate its positioning. The presence of the retainers allows for the application of a predetermined pressure on the bonding surfaces to enhance the bonding strength while preventing an undesirable strain from forming in the bonding surface of the rubber vibration insulator.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: December 1, 1998
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Akira Mabuchi, Kanae Matsumura, Takayoshi Iwata, Kazutoshi Miyake, Kyouichi Fujinami, Masato Ueno, Satomi Watanabe, Kazuya Ito, Hideyuki Imai, Hiroshi Yokoi