Abstract: The vehicle interior component includes a front surface side space and a slit. A light emitting part, which is disposed on a vehicle interior outer side with respect to at least one of the vehicle interior outer side end of the panel lower portion of the upper panel and the vehicle interior outer side end of the panel upper portion of the lower panel and emits light emitted obliquely upward toward an inside of a vehicle interior through the slit, is provided.

Abstract: A lighting device to be installed in an instrument panel inside a vehicle to be used as an indirect lighting device to emit a light reflected on a surface of the instrument panel. The lighting device is installed at a space behind the instrument panel while being separated from a gap to serve as a light extraction slot of the instrument panel.

Abstract: A lighting device to be installed on an instrument panel in a vehicle cabin. The lighting device is configured to emit light in a first direction toward a seat in the vehicle cabin so as to be directly visually perceived by an occupant sitting in the seat and to emit light in a second direction toward an interior of the vehicle cabin so as to be reflected by the interior and then visually perceived by the occupant.

Abstract: The vehicle interior component includes a front surface side space and a slit. Alight emitting part, which is disposed on a vehicle interior outer side with respect to at least one of the vehicle interior outer side end of the panel lower portion of the upper panel and the vehicle interior outer side end of the panel upper portion of the lower panel and emits light emitted obliquely upward toward an inside of a vehicle interior through the slit, is provided.

Abstract: A vibration waveform output by a gyro sensor set in a main pump is received. The vibration waveform is subjected to a frequency analysis and a frequency spectrum is calculated. A feature value is calculated from the frequency spectrum. Life expiration of the main pump is determined using the feature value. When the feature value is represented as R, a sum of squares of amplitudes in the frequency spectrum is represented as D, and a sum of squares of the amplitudes exceeding a first determination value is represented as P, R=?(P/D).

Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.

Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.

Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller than the number of green LEDs.

Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.

Abstract: A sealing member for a short-wavelength light emitting element comprises a main agent and a curing agent. The main agent comprises a first component of an alicyclic epoxy produced by hydrogenating an aromatic epoxy, preferably a bisphenol A epoxy, and a second component of an alicyclic epoxy having a lower molecular weight than the first component. The mixing amount of the second component is not less than 10% by weight and less than 30% by weight based on the main agent.

Abstract: A sealing member for a short-wavelength light emitting element comprises a main agent and a curing agent. The main agent comprises a first component of an alicyclic epoxy produced by hydrogenating an aromatic epoxy, preferably a bisphenol A epoxy, and a second component of an alicyclic epoxy having a lower molecular weight than the first component. The mixing amount of the second component is not less than 10% by weight and less than 30% by weight based on the main agent.

Abstract: An alicyclic epoxy resin is used as a material for forming a member for sealing a Group III nitride compound semiconductor light-emitting device.