Patents by Inventor Kanako MATSUO

Kanako MATSUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive adhesive and cured product thereof
    Patent number: 11332645
    Abstract: There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: May 17, 2022
    Assignee: THREEBOND CO., LTD.
    Inventors: Kanako Matsuo, Hitoshi Mafune
  • CONDUCTIVE ADHESIVE AND CURED PRODUCT THEREOF
    Publication number: 20210040358
    Abstract: There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.
    Type: Application
    Filed: January 8, 2019
    Publication date: February 11, 2021
    Inventors: Kanako MATSUO, Hitoshi MAFUNE