Abstract: A semiconductor device includes a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; and an insulting film which is formed in the first and second areas so as to expose the third area and to cover portions of the substrate and the wirings. The semiconductor element which is electrically connected to the wirings within the third area. The semiconductor element has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract: A semiconductor device includes a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; and an insulting film which is formed in the first and second areas so as to expose the third area and to cover portions of the substrate and the wirings. The semiconductor element which is electrically connected to the wirings within the third area. The semiconductor element has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.

Abstract: A semiconductor device includes a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; and an insulting film which is formed in the first and second areas so as to expose the third area and to cover portions of the substrate and the wirings. The semiconductor element which is electrically connected to the wirings within the third area. The semiconductor element has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.

Abstract: A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion.

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract: A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion.

Abstract: Disclosed herein is a semiconductor device comprising a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; an insulting film which is formed in the first and second areas so as to expose the third area and covers the substrate and the wirings; and the semiconductor element which is electrically connected to the wirings within the third area and which has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.

Abstract: A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion.

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract: A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion.

Abstract: A program generating system which automatically rewrites a program using an individual's language upon addition of an application-specific add-on board has a program generating device for generating a program using an individual's language and a transformation data updating device for updating transformation data to generate updated transformation data for indicating rewriting the program upon addition of the application-specific add-on board. The program generating device transforms an initial document described in the individual's language into a computer program according to a given role pattern and role assignment knowledge.

Abstract: A program generating system uses the language of an individual to write a program in expressions with words of the programmer himself which can easily be understood from the side of an application object, and to generate expressions according to a designated programming language from the program written with the words of the programmer himself. The program generating system has a first processor for transforming a user's linguistic expression into an initial role tree, a second processor for detailing and transforming a vocabulary expression of said initial role tree into a beginning role tree, a third processor for detailing and transforming said beginning role tree into an ending role tree, and a fourth processor for generating a source code of a programming language from said ending role tree. The first processor transforms the user's linguistic expression into a description in the form of the role tree.