Abstract: A ceramic powder including ceramic main component particles and additive component particles deposited on the surfaces of the main component particles. The mean particle size of the main component particles is made not more than 1.5 ?m, and the mean particle size of the additive component particles is made not more than 0.31 ?m. The content of the additive composition particles is made 0.1 to 5 wt % with respect to 100 parts by weight of the ceramic powder. The dispersibility of the additive component particles with respect to the main component particles is improved and the uniformity of the structure is promoted to suppress the occurrence of hetero phases. A multilayer ceramic electronic device having a high insulation breakdown voltage and long life even with a thickness of the dielectric layers of not more than 3 ?m are provided.

Abstract: A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal electrode on the surface of the first ceramic coating layer, then forming a second ceramic coating layer on the surface of the first ceramic coating layer so as to cover the internal electrode. In this case, when a mean particle size of ceramic particles of the first ceramic coating layer is &agr;1, a thickness of the first ceramic coating layer is T1, a mean particle size of ceramic particles of the second ceramic coating layer is &agr;2, and a thickness of the second ceramic coating layer is T2, the conditions of &agr;1≦&agr;2, 0.05<&agr;1≦0.35 &mgr;m, T1<T2, and 0<T1<1.5 &mgr;m are satisfied. As a result, it is possible to provide a ceramic electronic device, in particular a multilayer ceramic capacitor, resistant to short-circuit defects, withstand voltage defects, and other structural defects.

Abstract: A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal electrode on the surface of the first ceramic coating layer, then forming a second ceramic coating layer on the surface of the first ceramic coating layer so as to cover the internal electrode. In this case, when a mean particle size of ceramic particles of the first ceramic coating layer is &agr;1, a thickness of the first ceramic coating layer is T1, a mean particle size of ceramic particles of the second ceramic coating layer is &agr;2, and a thickness of the second ceramic coating layer is T2, the conditions of &agr;1≦&agr;2, 0.05<&agr;1≦0.35 &mgr;m, T1<T2, and 0<T1<1.5 &mgr;m are satisfied. As a result, it is possible to provide a ceramic electronic device, in particular a multilayer ceramic capacitor, resistant to short-circuit defects, withstand voltage defects, and other structural defects.

Abstract: A ceramic powder including ceramic main component particles and additive component particles deposited on the surfaces of the main component particles. The mean particle size of the main component particles is made not more than 1.5 &mgr;m, and the mean particle size of the additive component particles is made not more than 0.31 &mgr;m. The content of the additive composition particles is made 0.1 to 5 wt % with respect to 100 parts by weight of the ceramic powder. The dispersibility of the additive component particles with respect to the main component particles is improved and the uniformity of the structure is promoted to suppress the occurrence of hetero phases. A multilayer ceramic electronic device having a high insulation breakdown voltage and long life even with a thickness of the dielectric layers of not more than 3 &mgr;m are provided.

Abstract: A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal electrode on the surface of the first ceramic coating layer, then forming a second ceramic coating layer on the surface of the first ceramic coating layer so as to cover the internal electrode. In this case, when a mean particle size of ceramic particles of the first ceramic coating layer is &agr;1, a thickness of the first ceramic coating layer is T1, a mean particle size of ceramic particles of the second ceramic coating layer is &agr;2, and a thickness of the second ceramic coating layer is T2, the conditions of &agr;1≦&agr;2, 0.05<&agr;1≦0.35 &mgr;m, T1<T2, and 0<T1<1.5 &mgr;m are satisfied. As a result, it is possible to provide a ceramic electronic device, in particular a multilayer ceramic capacitor, resistant to short-circuit defects, withstand voltage defects, and other structural defects.